Principal Packaging Design Integration Engineer

Job Title

Principal Packaging Design Integration Engineer

Role Summary

Hands-on engineering role to design and integrate electro-optical transceivers using GF's Photonix platform and advanced 2.5D/3D packaging form factors. The role focuses on thermal, mechanical, electrical and optical co-design to meet product performance, reliability, and manufacturability targets.

Experience Level

Senior — principal-level role. Candidates are expected to have multiple years of industry experience in advanced packaging design and product integration (see Education Requirements for degree guidance).

Responsibilities

Deliver packaging solutions from development to production and lead cross-functional technical efforts.

• Drive SiPh advanced packaging product innovation and design enablement for customers and OSAT partners.
• Support new customer product introductions with packaging design rules and solutions.
• Lead and chair design reviews with cross-functional teams to resolve technical and yield issues.
• Develop complex analysis models to predict manufacturability, cost, and quality.
• Define electrical, photonic and thermal requirements for chiplet and module designs.
• Establish and enforce global design processes and qualification robustness to reduce redesign risk.
• Drive continuous improvement plans (CIP) to meet organizational goals.
• Mentor and develop engineering team skills in packaging design constraints and considerations.
• Comply with Environmental, Health, Safety & Security requirements in all activities.
• Travel up to 10% to other GlobalFoundries facilities as required.

Requirements

Key must-have technical skills and proven experience. Preferred skills listed separately.

• Must-have: Experience bringing packaged products from development into production.
• Must-have: Advanced packaging design and layout expertise, including chip-package interaction for advanced SiPh packaging.
• Must-have: Experience with design and modeling tools such as HFSS, Zmax, Flotherm or equivalent.
• Must-have: Strong written and spoken English communication skills.
• Nice-to-have: Experience with failure analysis, design of experiments, and packaging process integration.
• Nice-to-have: Track record of photonic and electrical interconnect innovation and product releases with internal teams or OSAT partners.
• Nice-to-have: Broad knowledge of current and emerging technology, design, and manufacturing trends relevant to advanced packaging.

Education Requirements

PhD preferred, or MS plus 2 or more years of relevant experience. Preferred backgrounds include materials science, thermal, mechanical engineering or simulation disciplines. (Degree and field guidance taken from the source posting.)

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.