Principal Package Engineer (Takasaki / Toyosu)

Job Title

Principal Package Engineer (Takasaki / Toyosu)

Role Summary

Senior technical role responsible for package development, thermal/mechanical characterization, reliability and NPI support for Power MOSFET products. The role coordinates across design, reliability, manufacturing and external suppliers to deliver qualified packages and documentation.

Position operates on a hybrid schedule (two remote days per week; in-office days typically Tuesday–Thursday) at the Takasaki site.

Experience Level

Senior-level (Principal). Typical background: 7+ years in semiconductor package engineering, thermal analysis, or reliability engineering.

Responsibilities

Primary responsibilities include package development, thermal and reliability engineering, simulation, benchmarking, and customer support.

• Define package requirements and specifications for new Power MOSFET products (TOLL/TOLG/TOLT, BSC, DSC, TSC, advanced lead-frame and clip-bond packages).
• Support package qualification, AEC-Q101 compliance activities, and drive packaging tasks during NPI and product transitions.
• Perform thermal analysis, thermal resistance/impedance measurements, and package characterization.
• Evaluate and test reliability: power cycling, thermal cycling, solder joint reliability, mechanical stress; perform failure analysis and root-cause investigations.
• Develop and maintain thermal and mechanical simulation models; correlate simulation with test data and collaborate on system-level thermal optimization.
• Benchmark competitor package technologies, conduct reverse engineering and recommend roadmap/technology improvements.
• Provide product and customer support: package selection, thermal performance, and application notes; liaise with application engineering teams.
• Coordinate cross-functional package activities with design, product, reliability, manufacturing, marketing and external suppliers; participate in product reviews.

Requirements

Must-have technical skills and practical experience, with additional desirable skills listed separately.

• Thermal characterization and thermal analysis experience (measurements and interpretation).
• Semiconductor package design fundamentals and package-level failure analysis techniques.
• Reliability testing and qualification experience (power cycling, thermal cycling, solder-joint evaluation).
• Statistical data analysis skills for test and qualification results.
• PCB and thermal design knowledge relevant to power packages.

Nice-to-have:

• Experience with thermal simulation tools: ANSYS Icepak, ANSYS Mechanical, FloTHERM.
• Familiarity with automotive semiconductor requirements and processes: AEC-Q101, APQP/PPAP.

Education Requirements

Not specified.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.