Principal Package Competence Engineer

Job Title

Principal Package Competence Engineer

Role Summary

Lead technical authority for semiconductor package development for Nexperia's Power MOSFET portfolio. Work with product lines, assembly sites and R&D to develop, industrialize and validate package solutions and to shape the packaging technology roadmap.

Provide subject-matter expertise, evaluate emerging technologies, lead technical initiatives and act as the primary technical interface with manufacturing and external stakeholders.

Experience Level

Senior — typically 8+ years of relevant semiconductor experience. The posting provides guidance of PhD +5 years or Bachelor's/Master's +8 years.

Responsibilities

Primary responsibilities include package design, technical leadership, industrialization and cross-functional coordination.

• Lead package design studies and development for new and existing products.
• Act as recognized expert in semiconductor packaging and assembly technologies.
• Evaluate and validate emerging package and process technologies using simulation and technical studies.
• Contribute to package strategy and long-term technology roadmaps.
• Serve as technical interface between business groups and assembly manufacturing sites.
• Lead qualification, process freeze and industrialization activities.
• Support failure analysis, reliability testing and root-cause investigations.
• Apply DOE and data-analysis techniques to solve technical problems.
• Mentor junior engineers and promote knowledge sharing across the organisation.
• Generate innovative package concepts and lead high-profile technical initiatives.

Requirements

Must-have technical skills and experience. Educational qualifications are summarized separately below.

• Extensive experience in semiconductor packaging and assembly technologies.
• Experience with power semiconductor technologies and their applications.
• Proven record of package innovation, technology development, or patent generation.
• Experience supporting global manufacturing and assembly organisations and engaging in customer-facing technical discussions.
• Strong knowledge of package materials, assembly processes and reliability requirements.
• Experience with failure analysis, reliability testing and root-cause investigation.
• Proficiency with advanced package design and simulation tools.
• Strong technical documentation and presentation skills; ability to lead and influence cross-functional teams.

Education Requirements

PhD with 5+ years industry experience, or a Bachelor's/Master's degree with 8+ years of relevant semiconductor experience. No specific field of study was specified in the posting. The posting also notes the company may offer funded academic support up to PhD level (benefit, not a requirement).

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.