Principal Mechanical Engineer

Job Title

Principal Mechanical Engineer

Role Summary

Lead architecture, mechanical design, development, and industrialization of high-speed OSFP optical transceiver modules (800G, 1.6T, and future pluggable platforms). Work cross-functionally with optics, electrical, thermal, reliability, manufacturing, and supplier teams to deliver high-performance products at hyperscale volumes.

Experience Level

Senior level. Expect 12–20+ years of relevant experience in optical transceivers, networking systems, semiconductor packaging, or data center hardware.

Responsibilities

Accountable for end-to-end mechanical delivery of OSFP modules and related hardware, from concept through mass production.

• Define module architecture, mechanical stack-up, interfaces, retention mechanisms, cages, and thermal paths.
• Design precision components: sheet metal, die castings, injection-molded plastics, CNC parts, and TIMs.
• Optimize for thermal performance, structural integrity, EMI shielding, manufacturability, reliability, and cost.
• Drive advanced thermal solutions (heat sinks, vapor chambers, heat spreaders, liquid-cooling interfaces, TIM selection).
• Perform or specify thermal simulations and CFD as needed (FloTHERM, Icepak, etc.).
• Lead reliability validation: thermal cycling, mechanical shock/drop, vibration, HALT/HASS, environmental testing.
• Define GD&T strategy and perform tolerance stack-up analysis for critical thermal and optical interfaces.
• Develop DFM/DFA guidelines, assembly processes, quality controls, and automation opportunities.
• Lead NPI, supplier qualification, manufacturing transfer, yield improvement, and root-cause analysis (8D, DMAIC, Fishbone, DFMEA/PFMEA).
• Mentor and provide technical leadership to engineering teams and present findings to executives.

Requirements

Must-have technical skills, experience, and responsibilities for successful performance in the role.

Must-have:

• 12–20+ years of mechanical engineering experience in optical transceivers, networking systems, semiconductor packaging, or data center hardware.
• Deep expertise with OSFP/QSFP mechanical systems, thermal management, precision tolerance engineering, EMI/EMC, and reliability engineering.
• Proficiency in Creo, SolidWorks, or NX CAD tools.
• Experience with precision component design using sheet metal, die cast, injection molding, and CNC machining.
• Proven NPI and manufacturing transfer experience at high-volume scale; supplier management and qualification.
• Strong GD&T, tolerance analysis, material science, and test/validation experience.
• Experience driving yield improvement and root-cause analysis (8D, DMAIC, DFMEA/PFMEA).
• Program leadership and the ability to communicate technical results to executive stakeholders.

Nice-to-have:

• Experience with 800G/1.6T optical modules and OSFP MSA specifications.
• Knowledge of co-packaged or near-packaged optics and high-volume manufacturing models.
• Experience with copper alloys, Zamak die casting, advanced TIMs, and specialized thermal materials.

Education Requirements

Bachelor's or Master’s degree in Mechanical Engineering or a related field. Preferred items mentioned in the posting include Six Sigma certification and patent publications.

About the Company

Company: Lumilens

Headquarters: San Jose, CA, USA

Lumilens develops integrated photonics and optical interconnect solutions for high-speed data communication and chip-to-chip interfaces, focusing on optical front-end hardware and co-packaged optics for advanced semiconductor systems.