Principal/Master Engineer - Silicon Photonics Advanced Packaging

Job Title

Principal/Master Engineer - Silicon Photonics Advanced Packaging

Role Summary

Lead technical development of packaging and assembly for a scalable silicon photonics platform. Act as the primary technical owner for packaging design, process development and ramp to volume production, coordinating internal design teams and external OSAT/CM partners.

Experience Level

Senior — 15+ years of experience in semiconductor advanced packaging, photonics assembly, or related manufacturing operations.

Responsibilities

Primary responsibilities include:

• Provide technical leadership for advanced packaging design, substrate definition, and assembly process development.
• Define and enforce packaging specifications, design rules and Design for Manufacturing (DFM) guidelines.
• Collaborate with PIC, IC, opto-mechanical and assembly teams to align package architectures with electrical, optical and thermal requirements.
• Lead OSAT/CM engagements for wafer- and chip-scale assembly development and supplier qualification.
• Drive New Product Introduction (NPI) through high-volume production, focusing on yield optimization and production ramp.
• Troubleshoot complex assembly issues and implement risk-mitigation and process-control strategies.
• Evaluate and deploy 2.5D/3D packaging technologies and guide cross-functional DFM decisions.

Requirements

Must-have qualifications and skills:

• 15+ years of hands-on experience in semiconductor advanced packaging, silicon photonics assembly, opto-mechanical design, or manufacturing operations.
• Deep understanding of wafer-, chip- and board-level assembly processes, including 2.5D/3D integration techniques and their trade-offs for photonics.
• Proven experience driving NPI to high-volume production and implementing yield improvement programs.
• Operational experience managing OSATs/CMs: setting process control windows, troubleshooting line excursions, and directing yield engineering.
• Strong problem-solving ability and demonstrated track record as an independent, decisive technical leader.

Nice-to-have:

• Proven history of developing high-yield optical products, preferably based on silicon photonics.
• Experience implementing DFM for photonics packaging and working with cross-disciplinary design teams.

Education Requirements

MS or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Optical Physics, or a related engineering discipline.

About the Company

Company: Broadcom

Headquarters: Irvine, California, United States

Broadcom is a global technology leader that designs, develops, and supplies a wide range of semiconductor and infrastructure software solutions. The company is known for its innovations in wireless and broadband communications, enabling a connected world.