Principal Foundry Interface Design Engineer, HBM

Job Title

Principal Foundry Interface Design Engineer, HBM

Role Summary

Join Micron’s HBM Design Architecture team to provide technology support for the design and development of advanced HBM DRAM products. Act as the technical bridge between internal design teams, foundries, and technology development groups to translate process capabilities into scalable, high-performance architectures.

Work focuses on performance, power, reliability, PDK enablement, test-chip validation, and AI-enabled engineering productivity improvements.

Experience Level

Senior (Principal). Typical requirement: 6+ years of semiconductor industry experience.

Responsibilities

Key responsibilities include foundry interface, circuit simulation, test-chip validation, PDK enablement, and applying AI-enabled workflows to improve engineering productivity.

• Serve as primary technical interface between foundries and Micron design organizations; drive closure of design–process gaps.
• Define technology requirements for future HBM and custom memory products; influence foundry roadmaps for TSV, BEOL, reliability, and design enablement.
• Perform HSPICE simulations, evaluate compact/PDK SPICE models, and conduct pre-layout and post-layout circuit analysis.
• Plan and execute technology evaluation test chips; define process monitors and benchmark vehicles; analyze post-silicon data and correlate with simulations.
• Evaluate foundry PDKs and IP collateral; produce design guidelines, analog recommendations, and PPA evaluation methodologies.
• Support BEOL optimization and routing studies; collaborate with CAD teams on flow enablement and validation.
• Identify and implement AI-enabled automation and knowledge-management practices to improve DTCO analysis and design enablement workflows.

Requirements

Must-have technical skills and experience.

• 6+ years of semiconductor industry experience with advanced semiconductor technology development.
• Strong understanding of advanced CMOS technology nodes, FinFET devices, and process integration.
• Hands-on experience with HSPICE simulations, device characterization, standard cell benchmarking, PPA analysis, parasitic extraction, and physical verification.
• Experience implementing AI-enabled engineering practices and automation for DTCO, PDK evaluation, benchmarking, and knowledge sharing.

Preferred qualifications:

• Direct experience with leading foundries (TSMC, Samsung, Intel Foundry Services, GlobalFoundries).
• Experience with memory products such as DRAM, HBM, or SRAM; knowledge of TSV and advanced packaging technologies.
• Knowledge of reliability modeling and aging simulations, advanced BEOL technologies, and PDK development/validation.
• Ability to use AI tools to summarize and extract insights from PDK documentation, design rule manuals, reliability reports, foundry collateral, and silicon characterization data.
• Experience leading technology pathfinding and node selection activities.

Education Requirements

Bachelor's, Master's, or PhD in Electrical Engineering, Computer Engineering, or a related field - or equivalent practical experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.