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Principal ESD & Latch-up Engineer - HBM (TPG)

Micron Technology
September 29, 2026
Full-time
On-site
Hsinchu, Taiwan
Device Engineering Jobs, Level - Senior

Job Title

Principal ESD & Latch-up Engineer - HBM (TPG)

Role Summary

Define and own ESD and latch-up protection strategies for HBM/DRAM products across design, validation, and manufacturing. Work closely with layout, silicon validation, foundries, packaging, reliability, and product teams to ensure robust product behavior from pre-silicon to high-volume production.

Experience Level

Senior-level (Principal). Significant hands-on experience in ESD and latch-up engineering is required. Years of experience not specified.

Responsibilities

Core responsibilities include:

  • Define and own chip-level and IP-level ESD and latch-up strategies for HBM DRAM, base die, I/O, TSVs, and die-to-die interfaces.
  • Establish ESD and latch-up requirements, targets, and sign-off criteria aligned with JEDEC/ESDA standards.
  • Enable ESD protection circuit designs and latch-up–safe layout practices across technologies.
  • Lead silicon validation, failure analysis, and correlation of pre-silicon assumptions to silicon results.
  • Act as the technical interface to foundries and partner with design, packaging, reliability, and product teams.
  • Provide technical leadership and mentor engineers to influence design methodology (preferred).

Requirements

Must-have technical skills and experience:

  • Strong fundamentals in ESD physics, latch-up mechanisms, and advanced CMOS devices.
  • Hands-on experience with ESD protection circuits and latch-up prevention techniques.
  • Experience with silicon validation and failure analysis; ability to correlate pre-silicon models to silicon results.
  • Familiarity with JEDEC and ESDA standards, including HBM, CDM, and JESD78.
  • Experience interfacing with foundry ESD and latch-up teams and collaborating across functions.

Nice-to-have:

  • Experience supporting ESD and latch-up sign-off for advanced DRAM or HBM products.
  • Knowledge of SCR-based clamps, distributed ESD networks, and rail-based strategies.
  • Proven ability to mentor engineers and influence cross-team design practices.

Education Requirements

Master's degree or Ph.D. in Electrical Engineering, or equivalent industry/practical experience.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-09-29