Principal Engineer, Signal Integrity & Power Integrity

Job Title

Principal Engineer, Signal Integrity & Power Integrity

Role Summary

Senior technical leader responsible for signal integrity (SI), power integrity (PI), and die-package-board co-design for custom silicon products. Owns electrical architecture, signoff criteria, and cross-disciplinary execution to meet performance, power, cost, reliability, and manufacturability goals.

Experience Level

Level: Senior. Minimum 10+ years of relevant semiconductor experience; at least 5 years leading SI/PI activities for complex SoCs, ASICs, or high-performance systems.

Responsibilities

Lead system-level electrical design, validation, and cross-team/customer engagement to ensure first-pass silicon performance across silicon, package, and board domains.

• Define SI/PI strategy, methodologies, design guidelines, and signoff criteria for products across target markets (industrial, automotive, AI, networking).
• Specify electrical architecture and system-level requirements for power delivery networks, high-speed interfaces, and board topologies.
• Drive die-package-board co-design: IO planning, bump assignment, floorplan optimization, package routing, and board stackup definition.
• Perform and guide SI/PI/EM/channel compliance simulations and electrical performance analysis across die, package, and board.
• Lead validation and characterization: define validation strategies, support simulation-to-silicon correlation, silicon bring-up, and root-cause analysis.
• Mentor engineers and lead technical initiatives to establish engineering best practices and align team direction with product priorities.
• Engage customers, package and PCB vendors, OSATs, and ecosystem suppliers to align technical requirements and roadmaps.
• Monitor and incorporate advances in packaging, chiplets, UCIe, power delivery, and high-speed interconnect technologies.
• Ensure compliance with Environmental, Health, Safety & Security requirements in engineering activities.

Requirements

Must-have technical skills and experience required for the role.

• Minimum 10+ years of semiconductor experience with demonstrated SI/PI and electrical design expertise.
• Minimum 5+ years leading SI/PI activities for complex SoCs, ASICs, or high-performance systems.
• Deep knowledge of high-speed interfaces and system architectures (PCIe, Ethernet, DDR/LPDDR, SerDes, UCIe, USB, MIPI, etc.).
• Proficiency with industry-standard EDA and analysis tools (examples: Cadence Sigrity/Clarity, Ansys HFSS/SIwave, Q3D, Synopsys SI/PI tools).
• Strong understanding of package technologies (Flip-Chip, FCBGA, WLCSP, wire-bond, interposers, chiplets, 2.5D/3D) and manufacturing/yield/reliability considerations.
• Experience in system-level electrical architecture, package power delivery networks, and board-level implementation.
• Proven communication, documentation, and cross-functional collaboration skills for customer-facing and internal technical work.
• Experience driving vendor and partner engagements (package vendors, PCB vendors, OSATs, foundries).

Preferred / Nice-to-have:

• Experience with AI/HPC, networking, automotive platforms, and HBM-based systems.
• Contributions to industry standards, patents, publications, or conference presentations in SI/PI or packaging.
• Experience developing enterprise-wide SI/PI signoff flows and best practices across product teams.

Education Requirements

Master's degree or higher in Electrical Engineering, Computer Engineering, Applied Physics, Electromagnetics, or a related technical field.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.