Principal Engineer - Signal Integrity

Job Title

Principal Engineer - Signal Integrity

Role Summary

Lead development and analysis of high-speed memory interfaces and power distribution networks (PDN). Apply automation and AI/ML techniques to accelerate signal- and power-integrity analysis, simulation efficiency, and engineering decision-making.

Work within the SI R&D team and represent SI interests across package, silicon, system, product engineering, and standards bodies to enable next-generation memory technologies.

Experience Level

Senior / Principal level. The role requires significant industry experience; the posting indicates a minimum of 5 years of industry experience (title indicates a senior principal role).

Responsibilities

Accountabilities include technical leadership, cross-functional collaboration, and driving SI/PI innovation for memory products.

• Lead development and analysis of high-speed memory I/O interfaces and PDN design.
• Develop and apply AI/ML and data-driven methods to speed SI/PI analysis and design decisions.
• Automate simulation workflows and apply scripting/AI-assisted engineering to improve coverage and efficiency.
• Represent SI R&D in cross-functional technical forums with package, silicon, system, product, and marketing teams.
• Drive SI/PI contributions to industry standards (e.g., JEDEC, ONFI, IBIS) and explore system-level electrical capabilities.
• Formulate SI/PI analysis techniques and protocols and support path-finding for I/O and channel innovation.
• Support external customers and measurement/validation activities as required.

Requirements

Must-have technical skills and experience; nice-to-have items are noted separately.

• Deep experience in Signal Integrity and Power Integrity affecting I/O signaling and PDN performance.
• Experience using electromagnetic field solvers and time/frequency-domain simulation tools (examples: Q3D, SIWAVE, HFSS, POWERSI, CLARITY, HSPICE, ADS, or similar).
• Strong understanding of electromagnetic and transmission-line theory, differential and single-ended interface technologies.
• Expertise in PCB layout or electrical package development techniques.
• Experience building and analyzing high-speed single-ended and differential buses.
• Familiarity with lab measurement equipment (oscilloscopes, TDR, VNA) for SI/PI validation.
• Experience with statistical analysis and DOE methods (tools such as JMP) is beneficial.
• Memory-industry experience is desirable.
• Ability to work independently, communicate complex technical issues clearly, and provide practical innovative solutions.

Education Requirements

PhD or MSEE preferred, or equivalent practical experience. The posting specifies at least 5 years of industry experience. Required academic background includes coursework in electromagnetics, transmission-line and RF theory, and analog build or related fields. Equivalent experience to a formal degree is explicitly allowed.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.