Principal Engineer, Quantum Topological Qubit Integration

Job Title

Principal Engineer, Quantum Topological Qubit Integration

Role Summary

The Principal Engineer will develop and execute semiconductor process integration strategies to enable scalable topological qubit platforms. This role bridges device concepts and manufacturable process flows, working with materials, epitaxy, device, packaging, and design teams to meet performance, yield, and reliability targets.

Experience Level

Senior-level; 5+ years of experience in semiconductor process or integration engineering.

Responsibilities

Key responsibilities include hands-on integration work, data-driven optimization, and cross-functional collaboration to deliver scalable quantum hardware.

• Integrate topological quantum devices including III-V heterostructures, superconducting films, and hybrid material systems into semiconductor process flows.
• Develop and execute process integration flows across device modules, BEOL interconnect, and heterogeneous integration schemes.
• Collaborate with epitaxy and materials teams to ensure interfaces and layer stacks meet device performance requirements.
• Design and execute DOE and analyze electrical and physical characterization data to guide process optimization.
• Develop superconducting interconnects and low-loss BEOL wiring suitable for cryogenic operation.
• Analyze device/process interactions: defectivity, variability, contamination, and interface quality; perform root-cause analysis.
• Align integration activities with device physics requirements (coherence, noise, thermal performance) and cryogenic readout/control needs.
• Define and track technical milestones for performance, variability, and reliability metrics.
• Document integration flows, assumptions, and technical learnings to support scale-up and knowledge transfer.
• Perform work in compliance with Environmental, Health, Safety & Security requirements.

Requirements

Must-have technical skills and experience are listed below; preferred items follow.

Must-have:

• Experience in semiconductor process or integration engineering with hands-on execution.
• Knowledge of semiconductor device physics and materials interactions.
• Familiarity with advanced materials systems such as III‑V semiconductors and superconductors.
• Experience analyzing electrical and physical characterization data and applying DOE methodologies.
• Strong analytical, problem-solving, debugging, and communication skills.

Nice-to-have:

• Experience with epitaxial growth (MBE, MOCVD) or III‑V heterostructures.
• Background in superconducting or hybrid semiconductor devices and topological quantum devices.
• Experience with BEOL integration, interconnect technologies, packaging, and cryogenic measurements.
• Experience with yield analysis, variability modeling, or advanced R&D in emerging technologies.

Education Requirements

BS or MS in Electrical Engineering, Physics, Materials Science, or a related technical field.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.