Principal Engineer, PD SG Thin Film (CVD/Diffusion)

Job Title

Principal Engineer, PD SG Thin Film (CVD/Diffusion)

Role Summary

Lead technical strategy and execution for thin film process development (CVD, diffusion, ALD) for advanced NAND at Fab 10N/X, Singapore. Manage multi‑functional teams from R&D through high‑volume manufacturing, focusing on manufacturability, scalability, integration, yield, cost, and reliability.

Drive technology transfer and ramp activities, resolve complex technical issues, mentor engineers, and represent the function in technical and strategic forums. Use AI-enabled tools where appropriate to improve process development and efficiency.

Experience Level

Senior-level role. See Education Requirements for the explicit years-of-experience mapping associated with degree levels.

Responsibilities

Accountable for leading thin film process development and technology transition into manufacturing.

• Define and implement technical strategy for structural and electrical film processes aligned to product and business objectives.
• Lead cross-functional teams to develop, integrate, and scale thin film processes for advanced NAND devices.
• Oversee end-to-end development of process modules with emphasis on manufacturability, scalability, and integration readiness.
• Diagnose and resolve complex process and device failures via root-cause analysis and mitigation.
• Drive technology transfer and ramp-up to high-volume manufacturing.
• Lead cost reduction, yield improvement, and reliability enhancement programs.
• Mentor senior engineers and provide executive-ready technical communication.
• Represent the organization in technical forums, strategic collaborations, and competitive benchmarking.
• Integrate AI-assisted tools and insights into work to improve efficiency, quality, or effectiveness while complying with organizational standards.

Requirements

Technical and behavioral must-haves for immediate contribution. Degree and years-of-experience details are listed under Education Requirements.

• Deep expertise in thin film deposition (ALD/CVD) and process design/optimization for high-density NAND.
• Advanced characterization skills (XRR, ellipsometry, SEM, TEM, SIMS, XPS) and electrical evaluation (leakage, impedance, capacitance, breakdown).
• Proficiency in SPC, DOE, and data analytics for process optimization and problem solving.
• Experience driving novel chemistries, materials, and hardware solutions (chamber design, plasma/source/gas delivery optimization).
• Demonstrated technical leadership, strong cross-functional and cross-site collaboration, and mentorship capability.
• Strong executive-level communication and ability to influence technical direction across the organization.
• Familiarity with competitive benchmarking and translating industry trends into actionable roadmaps is preferred.
• Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively.

Education Requirements

PhD with ≥5 years, or Master’s with ≥7 years, or Bachelor’s with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related technical field. Equivalent practical experience is considered per the stated experience thresholds.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.