Principal Engineer - PCB/Package Co-design

Job Title

Principal Engineer - PCB/Package Co-design

Role Summary

Join Arm's Packaging, Boards and Multiphysics team as a senior electronics engineer focused on PCB and silicon package co-design. You will define and influence system-level hardware architecture and platform requirements, working with SoC teams, architects and platform leads to develop physical development platforms for Arm IP.

This role emphasizes technical leadership across PCB layout, package trade-offs, signal/power integrity, manufacturability and cross-team coordination.

Experience Level

Senior-level (Principal). Specific years of experience not specified; this is a senior technical leadership role.

Responsibilities

Provide technical leadership for PCB and package integration across SoC and packaging teams. Key responsibilities include:

• Specify, evaluate and develop PCB and silicon package co-design solutions across distributed engineering teams.
• Drive PCB development in coordination with packaging teams: breakout planning, routing strategies, design rules and layer optimization.
• Translate technology requirements into platform architectures and justify timescales to program teams.
• Perform escape routing analysis and estimate routable IO for given stack-ups and rule sets.
• Assess package pinout options versus PCB routability, SI/PI, layer count, manufacturability and cost.
• Define or review PCB layout guidelines, placement constraints, PDN strategy and routing feasibility for early silicon and prototypes.
• Collaborate with PCB fabricators and contract electronics manufacturers (CEMs) to assess manufacturability of advanced PCB technologies.
• Communicate technical trade-offs clearly to silicon architects, packaging engineers and platform stakeholders.

Requirements

Must-have technical skills and experience:

• Deep understanding of SoC architectures and high-performance embedded compute platforms (Cloud/Edge AI, IoT).
• Experience with high-speed interfaces (e.g. PCIe Gen5/6/7, LPDDR5/6, CSI, DSI) and embedded storage/compute peripherals.
• Proven embedded system board design experience with complex LSI devices, FPGAs, PMICs and power-management considerations.
• Knowledge of IC packaging technologies and their impact on PCB design; experience collaborating with chip packaging teams and influencing pinouts.
• Expertise in signal and power integrity analysis from both board and package perspectives.
• Familiarity with PCB fabrication (PTH, HDI), stackups, VIA topologies and substrate materials.
• Proficiency with EDA tools for schematic entry and PCB layout (Cadence OrCAD & Allegro).
• Strong communication skills and ability to drive progress in a fast-paced, ambiguous environment.

Nice-to-have:

• Experience with signal integrity tools (ANSYS, Siemens EDA, etc.).
• Background in the semiconductor industry and deeper compute-architecture knowledge.
• Experience working across multiple geographies and with diverse engineering teams.

Education Requirements

Not specified.

About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.