Principal Engineer, Hybrid Bonding Module

Job Title

Principal Engineer, Hybrid Bonding Module

Role Summary

Lead development and scale-up of die-to-wafer hybrid bonding module technology from first-of-a-kind platforms through qualification and high-volume manufacturing. Work across technology development, process integration, equipment vendors, and manufacturing to deliver reliable, manufacturable hybrid bonding solutions that meet roadmap targets.

Experience Level

Senior-level. Company guidance: Bachelor's degree +15 years, Master's degree +10 years, or PhD +8 years of relevant experience.

Responsibilities

Primary responsibilities include technical leadership, development, and transfer to production:

• Define and drive the hybrid bonding roadmap: pitch scaling, alignment/overlay, yield, defectivity, and reliability targets.
• Lead module-level process development for die-to-wafer hybrid bonding and integrate with adjacent steps (die prep, thinning, planarization).
• Drive first-of-a-kind equipment and platform development from concept through implementation and scale to HVM.
• Develop and implement strategies to mitigate bond interface defects, alignment limitations, surface/material interactions, and contamination.
• Resolve systemic yield and reliability issues using data-driven and model-based methods.
• Partner with equipment vendors and materials suppliers to influence tool and material development.
• Collaborate across TD, process integration, and manufacturing to ensure consistent execution and successful ramp/transfer.
• Mentor and develop senior technical talent and domain experts.

Requirements

Must-have skills and experience:

• Deep practical expertise in hybrid bonding, wafer bonding, or advanced packaging module development.
• Experience with hybrid bonding equipment development and scaling first-of-a-kind platforms to high-volume manufacturing.
• Proven track record in process optimization, yield improvement, reliability enhancement, and process qualification/ramp.
• Ability to translate technology roadmaps into executable module strategies and to identify and mitigate equipment/process limitations.
• Experience operating across technology development and manufacturing environments.
• Strong communication, decision-making, and mentoring capabilities.

Nice-to-have:

• Experience delivering FOK hybrid bonding platforms into HVM and driving step-function improvements in yield and manufacturability.
• Familiarity with advanced packaging flows (chiplets, 2.5D/3D integration) and equipment-process co-optimization.
• Knowledge of bond interface physics (Cu-Cu, dielectric), defect mechanisms, contamination control, and alignment/overlay precision processes.

Education Requirements

Degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field. Company specifies: Bachelor's degree +15 years of experience, Master's degree +10 years of experience, or PhD +8 years of experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.