Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)

Job Title

Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)

Role Summary

Lead the High Bandwidth Memory (HBM) Product System Engineering Media Health team to drive manufacturing readiness, yield, test flow development, and qualification for next-generation HBM products (DRAM, interface die, stacked devices).

Own product KPIs for quality, cost, cycle time and scale; direct technical strategy, cross-functional execution, and team development to enable high-volume production.

Experience Level

Senior — typically requires 8+ years of experience in the semiconductor industry (as stated in the posting).

Responsibilities

Technical and leadership responsibilities to establish and maintain manufacturing testability, yield, and product qualification for HBM products.

• Define and optimize manufacturing test coverage and test flow for current and future HBM architectures and process nodes.
• Lead product development activities: validation, characterization, qualification, and release for HBM DRAM, interface die, and stacked products.
• Support design validation and circuit debug using CAD tools and Verilog simulations to identify failure modes and corrective actions.
• Drive yield improvement and test-time reduction through root-cause analysis and test strategy innovation.
• Resolve manufacturing test flow, qualification and RMA device issues with cross-functional teams.
• Make technical risk assessments and prioritize projects to meet business and manufacturing objectives.
• Mentor and develop engineering staff; promote project management and technical leadership within the team.
• Collaborate with Fab, Design, Technology Development, Test Solution Engineering, System Development, and Quality/Reliability teams.

Requirements

Key skills, behaviors, and constraints expected for the role. Must-haves are listed first; follow-on items are nice-to-have.

• Must-have: Strong technical leadership, problem solving and root-cause analysis skills, including in-depth circuit analysis.
• Must-have: Experience with statistics, data analysis tools and scripting for manufacturing analytics.
• Must-have: Proven collaborative experience across teams to solve complex engineering and business problems.
• Must-have: Excellent communication and presentation skills; demonstrated people leadership and mentorship.
• Must-have: Willingness to work onsite in Singapore; international travel to US, Taiwan and Japan as required.
• Nice-to-have: Product Engineering experience and familiarity with CAD-based verification and Verilog simulation workflows.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering. The posting specifies an engineering degree in this field.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.