Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)

Job Title

Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)

Role Summary

Lead the High Bandwidth Memory (HBM) Product Engineering Media Health team to develop and scale next-generation HBM products (DRAM, interface die, stacked products). Drive manufacturing test flow development and validation, yield improvement, DFT/test strategy, and cross-functional programs focused on quality, cost, cycle time and manufacturability.

Experience Level

Senior - requires substantial prior experience in semiconductor product or manufacturing engineering (guidance: the posting indicates 8+ years of semiconductor industry experience).

Responsibilities

Deliver technical leadership for test, yield and product qualification across HBM architectures and process nodes.

• Lead development and validation of manufacturing test flows and test time optimization for HBM products.
• Define and optimize test coverage and DFT strategy for DRAM, interface die and stacked die architectures.
• Perform in-depth circuit debug and root-cause analysis to improve device and stacked-die yield.
• Drive product characterization, qualification and reliability activities to meet quality and cycle-time targets.
• Resolve manufacturing test flow, qualification and RMA device issues.
• Prioritize technical risk, make program decisions, and promote innovation to improve cost and performance.
• Mentor and develop team members; build project management capabilities within the team.
• Collaborate with Fab, Design, Technology Development, Test Solution Engineering, and Quality/Reliability teams.
• Improve productivity and efficiency by applying data analysis and AI tools where appropriate.

Requirements

Must-have technical skills and professional attributes.

• Must-have: Proven leadership experience managing technical teams and programs in a semiconductor environment.
• Must-have: Strong circuit-level debugging and root-cause problem solving for test and yield issues.
• Must-have: Practical knowledge of statistics, data analysis tools and scripting for test/yield analysis.
• Must-have: Strong collaboration skills across engineering and fab organizations, with clear written and verbal communication.
• Must-have: Professional accountability, drive for results, and ability to operate in a dynamic manufacturing environment.
• Must-have: Willingness to work on-site in Singapore and travel internationally as needed.
• Nice-to-have: Product engineering experience and familiarity with HBM/DRAM/stacked-die technologies, DFT and CAD/Verilog-based design-validation support.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering is specified; the posting indicates 8+ years of semiconductor industry experience. Product engineering experience is preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.