Job Title
Principal Engineer - HIG HBM Layout
Role Summary
Lead end-to-end physical layout for HBM memory products, including analog, mixed-signal, custom digital blocks and full-chip integration. Work with cross-functional teams to deliver tape-outs meeting performance, power, area (PPA) and quality targets.
Experience Level
Senior level. Requires extensive experience leading layout teams and projects; posting specifies 15+ years in analog/custom layout and at least 4+ years of people/project leadership.
Responsibilities
Accountable for technical leadership, layout execution, verification closure and team development across multiple programs.
- Lead layout execution for analog, mixed-signal and custom digital blocks and full-chip integration for HBM products.
- Define and own full-chip technical decisions across analog, digital, memory, ESD, EM/IR to meet PPA targets.
- Perform and oversee layout verification activities (LVS, DRC, antenna checks) and ensure documented closure.
- Plan and track project schedules, area/time estimates, task delegation, and milestones for concurrent programs.
- Mentor and develop layout engineers; conduct design reviews and enable capability growth.
- Drive productivity improvements and automation/AI adoption to reduce layout effort and turnaround time.
- Collaborate with Design, Verification, IP and Packaging teams and support customer/product integration needs.
Requirements
Must-have technical skills and experience for the role.
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Must-have: 15+ years in analog/custom layout in advanced CMOS processes.
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Must-have: 4+ years of experience developing teams and leading projects, including multiple tape-outs.
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Must-have: Strong hands-on skills in layout, floorplanning and manual routing for critical blocks.
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Must-have: Proficiency with Cadence VLE/VXL and Calibre DRC/LVS.
- Experience running multiple custom IC layout projects concurrently across sites and time zones.
- Excellent verbal and written communication skills.
- Ability to work effectively in multi-functional, multi-site teams.
Education Requirements
BE or MTech in Electronics / VLSI Engineering.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

Date Posted: 2026-06-10