Principal Engineer - Electrical (High-speed Hardware)

Job Title

Principal Engineer - Electrical (High-speed Hardware)

Role Summary

Lead design and delivery of analog and mixed-signal electronics for compact, high-performance LiDAR hardware. Responsible for circuit architecture, PCB-level integration, validation, and production readiness.

Work within a small cross-functional team at the intersection of silicon photonics, system design, and firmware to produce reliable, manufacturable sensors.

Experience Level

Senior — 7+ years of hands-on hardware development experience with end-to-end ownership of products that shipped at scale.

Responsibilities

Design, validate, and deliver mixed-signal hardware from concept through production with emphasis on performance, manufacturability, and reliability.

• Architect low-noise analog front-ends (TIAs, precision current sources) and high-speed data paths (ADCs, digital interfaces).
• Produce schematics, select components, and drive PCB layout in collaboration with layout engineers.
• Ensure signal integrity (SI), power integrity (PI), and EMI/EMC compliance for high-speed and noise-sensitive interfaces.
• Define and execute bring-up, characterization, and validation plans (DVT, EVT) focused on robustness and repeatability.
• Analyze trade-offs across performance, cost, power, and form factor within constrained product architectures.
• Collaborate with systems, mechanical, and firmware teams to integrate hardware and ensure system-level reliability.

Requirements

Core technical and execution requirements; preferred qualifications listed separately.

• 7+ years hands-on hardware development with end-to-end ownership of shipped products.
• Proven ability to deliver high-reliability designs under constraints on power, cost, form factor, and schedule.
• Expertise in low-noise analog and high-speed digital design.
• Strong knowledge of SI/PI, high-density interconnect, and EMI mitigation techniques.
• Proficiency with schematic capture and simulation (e.g., SPICE) and PCB tools (Altium or similar).
• Experience with SI/PI simulation tools (e.g., HyperLynx, SiWave) and GHz-range measurement equipment (oscilloscopes, VNAs, spectrum analyzers).
• Familiarity with board-level integration of FPGAs, microcontrollers, and custom analog ASICs.

• Experience with high-speed ADCs, analog IC interfaces, or photonics-related electronics.
• Knowledge of flex and rigid-flex PCB design.
• Exposure to mixed-signal modeling (Verilog-AMS) or FPGA development (Verilog HDL).
• Experience designing for high-reliability or harsh environments (automotive, aerospace).

Education Requirements

Not specified.

About the Company

Company: Voyant Photonics

Headquarters: New York, NY, USA

New York City–based company developing compact silicon photonic LiDAR sensors that measure range, velocity, and reflectivity with high accuracy. Uses fingertip-scale silicon photonic chips to produce affordable, high-performance sensors for robotics, autonomous vehicles, drones, industrial automation, and other sensing applications.