Principal Engineer - Analog Design

Job Title

Principal Engineer - Analog Design

Role Summary

Senior analog/mixed-signal IC design engineer responsible for designing, validating, and optimizing analog circuits and layouts for advanced High Bandwidth Memory (HBM) products. Works across product, process, test, and CAD teams to ensure manufacturability and performance.

Experience Level

Senior / Principal. Years of experience not specified in the posting.

Responsibilities

Design, validate, and oversee implementation of analog/mixed-signal modules for HBM products and manage layout activities.

• Interpret product specifications and design analog/mixed circuits to meet functional and PPA targets.
• Design and improve circuits such as CMOS amplifiers, comparators, bandgaps, V-to-I converters, LDOs, charge pumps, oscillators, DLLs, IO circuits (DDR/LPDDR), delay circuits, and sensors in advanced process nodes.
• Integrate modules with the power delivery network and optimize for performance and reliability (device stress, aging).
• Perform EM/IR analysis and parasitic-aware simulations; import layout parasitics into circuit sims.
• Oversee layout process: floor-planning, placement, routing, and layout optimization for cost and performance.
• Run verification and simulations using industry-standard tools and methodologies.
• Support tape-out activities, reticle experiments, and required design revisions.
• Collaborate with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering to ensure manufacturability.
• Provide technical leadership, document best practices, and train or mentor team members.
• Leverage AI tools and agentic AI models to improve engineering efficiency and PPA optimization.

Requirements

Key skills and experience expected for the role.

• Must-have: Proven expertise in analog and mixed-signal IC design in advanced semiconductor process nodes.
• Must-have: Hands-on experience with circuit simulation and verification using tools such as HSPICE/FINESIM and Verilog-based flows.
• Must-have: Layout knowledge and experience with floor-planning, parasitic extraction, EM/IR analysis, and layout optimization.
• Must-have: Experience designing IO/DDR/LPDDR and other memory-related peripheral circuits.
• Must-have: Ability to lead tape-out activities, perform design validation, and iterate based on silicon results.
• Must-have: Strong cross-functional collaboration and technical leadership at a senior level.
• Nice-to-have: Prior experience with High Bandwidth Memory (HBM) product development or memory-array peripheral design.
• Nice-to-have: Familiarity with AI-assisted engineering workflows and agentic AI tools for design productivity.

Education Requirements

Not specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.