Principal Engineer, Advanced Packaging Technology Development

Job Title

Principal Engineer, Advanced Packaging Technology Development

Role Summary

Lead strategic technical direction for advanced packaging solutions on Micron's Advanced Packaging Technology Development (APTD) team based in Boise. Influence technology roadmaps, investment priorities, and cross-functional decisions to deliver production-ready packaging for memory and storage products.

Work with R&D, suppliers, and manufacturing to translate innovations into scalable, cost-effective processes that align with business objectives.

Experience Level

Senior-level. Requires over 10 years of professional experience in semiconductor advanced packaging.

Responsibilities

Primary responsibilities include:

• Define and drive advanced packaging technology roadmaps and investment priorities.
• Deliver differentiated technology solutions balancing performance, scalability, and total cost of ownership.
• Collaborate with internal R&D, suppliers, and manufacturing to integrate technologies into production.
• Provide technical leadership and consult on strategic decisions at senior management levels.
• Analyze competitive trends and metrics to inform strategy and requirements.
• Define technical requirements with validated data and drive trade-off decisions.
• Develop intellectual property and technical publications to support innovation and product wins.

Requirements

Key requirements and qualifications.

• Minimum: 10+ years of professional experience in semiconductor advanced packaging.
• Deep knowledge of High Bandwidth Memory (HBM), 2.5D integration, and emerging 3D integration strategies including hybrid bonding (required).
• Hands-on process/module engineering experience in wafer-level packaging or 3D stacking processes.
• Experience in DRAM manufacturing and with OSAT suppliers.
• Strong analytical skills for cost/value trade-offs and competitive benchmarking.
• Proven ability to influence cross-functional teams and senior leadership.
• Nice-to-have: understanding of DRAM wafer structure and process flows; patent record or published technical papers; proficiency in East Asian languages.

Education Requirements

BS, MS, or PhD in Materials Science, Electrical, Chemical, Mechanical Engineering, Physics, or a related technical field, or equivalent practical experience.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.