Principal Advanced Packaging Mechanical Engineer

Job Title

Principal Advanced Packaging Mechanical Engineer

Role Summary

Lead mechanical and thermal design and analysis for advanced microelectronic packaging in the Defense & Aerospace product development group. Collaborate with IC designers, module designers, process engineers, and CAD specialists to develop R&D prototypes and production-ready package solutions with emphasis on thermal performance and high-frequency operation.

Experience Level

Senior-level professional role. See Education Requirements for the stated minimum years of experience.

Responsibilities

Primary responsibilities include:

• Develop next-generation microelectronic package designs focused on advanced packaging, thermal management, and high-frequency performance.
• Collaborate with cross-functional teams (IC, module, process, CAD) to create R&D prototypes and production designs.
• Use industry-standard design tools to create package designs and supporting IP.
• Research and evaluate emerging materials for future product offerings.
• Guide package and substrate design decisions to meet performance specifications and yield targets.
• Respond to and supervise resolution of manufacturing and assembly issues.
• Track packaging technology trends across GaN, GaAs, Digital Si, and Analog Si and provide input on technology implementation.

Requirements

Must-have and relevant technical skills:

• Proven experience designing packaged microelectronic assemblies for defense, avionics, aerospace, or automotive applications.
• Experience with micro-fluidics in an electronics packaging context.
• Expert proficiency with SolidWorks or equivalent CAD tools.
• Deep knowledge of microelectronic package technologies, materials, manufacturing methods, plating, sealing, and interconnect technologies.
• Hands-on experience with package assembly processes: die attach, wire bond, flip chip, epoxy dispense, encapsulation, solder reflow.
• Familiarity with inspection tools, failure analysis techniques, and associated equipment.
• Understanding of reliability calculation methods for semiconductors.
• Knowledge of GD&T, ANSI standards, and tolerance stack-up practices.
• Demonstrated ability to work effectively with cross-functional teams and strong written and verbal communication skills.
• Ability to work on U.S. Government contracts and meet U.S. Person requirements; position is not eligible for visa sponsorship.

Education Requirements

BSME or MSME in Mechanical Engineering or a related field is required. The posting specifies a BSME/MSME with a minimum of 12 years' experience in semiconductor packaging.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.