Power Engineering Architect

Job Title

Power Engineering Architect

Role Summary

Lead the product power roadmap and drive power delivery architecture for high-performance compute, AI/ML accelerators and advanced ASIC platforms. Own system-level power delivery strategy, collaborate with ASIC, package, PCB, mechanical and product teams, and move solutions from concept through production.

This role is technically deep and execution-oriented, focused on enabling ultra-high current density and efficient thermal designs for data center accelerator systems.

Experience Level

Senior — 15+ years of hands-on experience in power delivery systems and related hardware development.

Responsibilities

Ownership and technical leadership for system power delivery and thermal solutions across product development.

• Lead system architecture exploration focused on power delivery and thermal management for AI accelerators.
• Define and drive vertical power delivery approaches to the wafer to enable ultra-high current density.
• Collaborate with product, ASIC, package, PCB, and mechanical teams to specify and validate power requirements.
• Architect power delivery systems optimized for electrical performance and cooling efficiency.
• Evaluate architectures and select strategic partners/vendors for technology development.
• Oversee solutions through full lifecycle: concept, design, validation, and production deployment.
• Coordinate cross-discipline trade-offs among silicon, package PDN, and thermal subsystems.

Requirements

Key must-have technical skills and domain experience. Preferred items are listed separately.

• Must-have:
• 15+ years of hands-on experience in power delivery systems for server or accelerator platforms.
• Proven practical experience in thermal modeling and implementing cooling solutions.
• Deep experience with high-current, low-voltage power delivery for advanced silicon.
• Experience with multiphase buck regulators, digital power controllers, DrMOS, smart power stages, and integrated voltage regulators.
• Familiarity with server hardware, AI accelerators, datacenter platforms, GPUs/CPUs/TPUs, or similar enterprise products.
• Strong interpersonal and cross-functional collaboration skills.
• Nice-to-have / Preferred:
• Experience developing advanced power modules with optimized thermal and magnetic characteristics.
• Background in semiconductor power technologies such as PMICs and integrated power modules.
• Experience with package PDN design, power vias, bumps, interposers, substrates, and ASIC power delivery structures.
• Expertise in power architecture for chiplet-based designs, IVRs, and 2.5D/3D integration.

Education Requirements

M.S. in Electrical Engineering (MSEE) or Computer Engineering (MSCE) required; Ph.D. preferred. Equivalent industry experience is acceptable where noted.

About the Company

Company: Cerebras

Headquarters: Sunnyvale, CA, USA

Developer of wafer-scale AI accelerators, Cerebras designs the Wafer Scale Engine (WSE)—one of the world’s largest AI chips—to deliver high-speed training and inference solutions for model labs, enterprises, and AI-native startups.