PIC Test Lead

Job Title

PIC Test Lead

Role Summary

Lead wafer-level optical and electrical test strategy for photonic integrated circuits (PICs) from first-silicon bring-up through high-volume manufacturing. Work with design, process integration, foundries, and test teams to architect scalable probe solutions and drive yield learning and factory transfers.

Experience Level

Senior — requires extensive experience; role expects 10+ years in PIC test engineering or related wafer-level probing and photonics manufacturing test.

Responsibilities

Own and execute wafer-level test programs, lead first-silicon bring-up, and enable manufacturing scale-up.

• Define and maintain wafer-level PIC test roadmap across product lines and technology platforms.
• Architect scalable optical plus electrical wafer probe solutions that balance alignment, stability, and throughput.
• Establish release criteria, guard-banding, and test coverage aligned to product requirements.
• Lead first-silicon bring-up: test content definition, limit setting, characterization, and rapid yield-learning cycles.
• Collaborate with design and PDK teams to specify DFT features (on-chip monitors, loopbacks, test waveguides, calibration structures).
• Perform yield ownership, spatial analytics, and root-cause investigations for coupling variation, lithography bias, and process drift.
• Qualify wafer probe infrastructure with foundries/OSATs and transfer test flows into volume manufacturing with tool correlation.
• Mentor engineers, set engineering standards, and act as technical escalation for yield and manufacturing issues.

Requirements

Must-have technical experience and responsibilities for immediate contribution.

• 10+ years in PIC test engineering, wafer-level probing, or photonics manufacturing test with proven ownership from R&D through HVM.
• Deep expertise in wafer-level optical probing, probe card qualification, and test time optimization.
• Experience leading yield learning, spatial analysis, and statistical separation of random vs. systematic issues.
• Proven track record of partnering with foundries and factories to qualify probe infrastructure and transfer flows to manufacturing.
• Strong debugging skills for first-silicon bring-up and early node transitions.

Preferred:

• Experience with high-speed optical and electrical testing of PICs or optical transceivers.
• Demonstrated influence on PIC DFT and collaboration with PDK development teams.
• Background in high-volume semiconductor or photonics manufacturing and scaling test infrastructure across nodes and product families.

Education Requirements

Not specified.

About the Company

Company: Xscape Photonics

Headquarters: Santa Clara, California, United States

Developer of integrated photonics solutions and instrumentation, specializing in photonic circuits, control systems, and test methodologies for optical communication and sensing applications. Works on device integration, control algorithms, and validation of photonic hardware and firmware.