Physical Design Intern
The Physical Design Intern supports the RTL-to-GDSII flow by assisting senior physical-design engineers with floorplanning, placement, routing, and physical verification for chip manufacturing. The role involves hands-on use of EDA tools in UNIX/Linux environments to help meet power, performance, and area (PPA) targets.
This is a hybrid internship based in Ho Chi Minh City with an expectation to work onsite four days per week and to commit to at least a six-month internship.
Entry-level internship intended for third-year or final-year bachelor's students. Student interns; no prior full-time industry experience required.
Work with the physical design team on implementation and verification tasks:
Minimum qualifications and practical requirements for the internship.
Third-year or final-year student currently pursuing a Bachelor's degree in Electrical Engineering, Computer Engineering, VLSI Systems, or a closely related field such as Physics or Mathematics.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
