Photonics Packaging Characterization Engineer (2026 New College Graduate)

Job Title

Photonics Packaging Characterization Engineer (2026 New College Graduate)

Role Summary

Hands-on packaging integration role within an advanced packaging and photonics team focused on electro-optical transceivers and heterogeneous integration for data center and high-performance applications.

Primary mission: develop and transition inspection and physical characterization methods for silicon photonics flip-chip and advanced packaging assemblies to ensure manufacturability, reliability, cost-effectiveness, and performance.

Experience Level

Entry-level / New college graduate. Typical experience: 1–3 years in semiconductor packaging, inspection, or physical characterization.

Responsibilities

The role is responsible for creating, validating, and transferring inspection and characterization workflows and supporting quality and continuous improvement activities in manufacturing.

• Develop and lead inspection and characterization workflows across assembly stages (die attach, underfill, lid attach, socket placement, fiber integration) including AOI, warpage analysis, and metrology.
• Establish and transfer inspection, characterization, and quality methodologies into manufacturing: packaging design rules, materials criteria, test structures, and participation in design reviews and FMEAs.
• Analyze data and collaborate cross-functionally to resolve technical, quality, and yield issues; drive standardization, qualification rigor, and continuous improvement.
• Support product quality, regulatory/compliance, and environmental health & safety requirements in manufacturing.
• Perform work safely and follow site EHS and security programs.

Requirements

Key qualifications and skills. The first list are must-have requirements; the second list shows preferred (nice-to-have) qualifications.

Must have:

• 1–3 years' experience in semiconductor packaging, inspection, or physical characterization.
• Fluent in English (written and verbal).

Nice to have:

• Internship or co-op experience in related fields.
• Hands-on experience with photonics and advanced packaging (2.5D, 3D, co-packaged optics, optical packaging).
• Experience with inspection and characterization tools such as AOI, profilometry, SEM, X-ray, and acoustic microscopy; failure analysis of electronic packages.
• Leadership or project management experience and strong planning/organizational skills.
• Strong written and verbal communication and ability to document technical work clearly.

Education Requirements

Master's degree or higher in Materials Science, Mechanical Engineering, Applied Physics, or a related technical field from an accredited program. Candidates must have demonstrated good academic standing; posting specifies an overall GPA of at least 3.0.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.