PDE PIE (Package Integration Engineering)

Job Title

PDE PIE (Package Integration Engineering)

Role Summary

Lead Package Integration Engineering activities as the Product Owner for new product introductions (NPI) in backend/assembly. Work with cross-functional teams (process, equipment, manufacturing, planning, TPM) to move new packages from development through first-pass qualification to volume production.

Primary mission: drive NPI phase-gate reviews, ensure product start-up meets timelines and customer requirements, and own the product life cycle from NPI to end-of-life.

Experience Level

Senior — minimum 8 years' experience in multinational semiconductor companies, with exposure to mobile and automotive product lines.

Responsibilities

Accountable for coordinating and executing package NPI and product introduction activities.

• Drive NPI phase-gate reviews and manage product introduction milestones.
• Coordinate new product start-up to achieve first-pass qualification and transition to volume.
• Communicate timelines, product applications, and customer requirements to cross-functional teams.
• Collaborate with process, equipment, manufacturing, and planning owners to resolve start-up issues.
• Support first silicon, engineering samples, qualification samples, and manage engineering hot-lot cycles per schedule.
• Monitor yield trends, QDRs, and reliability metrics; initiate corrective action as needed.
• Own product life cycle activities from NPI through EOL.
• Work with development teams to advance packaging technology and capabilities ahead of market needs.
• Serve as the primary product contact for TPM on product-related matters.

Requirements

Must-have technical skills and domain experience.

• Strong packaging knowledge in backend engineering processes or package development.
• Technical experience with component testing and/or module manufacturing processes.
• Familiarity with package structures (e.g., BGA, PoP) and package reliability concepts.
• Excellent data analysis and statistical interpretation skills; ability to make data-driven decisions and prioritize work.
• Proficiency with JMP for statistical analysis is required.
• Experience using AI-assisted tools (e.g., Copilot) to improve productivity in tasks such as root-cause screening, DOE design, and reporting.
• Proven experience in MNC semiconductor environments, preferably supporting mobile and automotive customers.

Education Requirements

Master's or Bachelor's degree in Engineering (Mechanical, Materials, Chemical) is required.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.