PDE CEM Engineer

Job Title

PDE CEM Engineer

Role Summary

Support development and introduction of HBM assembly processes and IQP for NPI and transfer to high-volume manufacturing at the Taichung MTB site. Work covers process development, equipment readiness, yield improvement, and cross-functional transfers between development and production.

Experience Level

Mid-level. No explicit years-of-experience requirement stated in the source.

Responsibilities

Primary responsibilities include leading NPI execution, process development, yield improvement, and ensuring manufacturing readiness.

• Lead NPI builds, pilot runs, and process qualification activities for HBM products.
• Develop and optimize assembly processes (IQP, stacking, bonding, cure); perform DOE and parameter optimization.
• Validate recipe setup, bonding profiles, alignment accuracy, and process repeatability.
• Drive yield improvement using data analysis (FDC, SPC) and failure analysis (PFA/EFA); implement corrective actions.
• Define and validate tooling requirements; support tool setup, calibration, troubleshooting, and release readiness.
• Perform risk assessment (FMEA), define process control strategies, and implement containment for abnormal conditions.
• Own NPI documentation (Bill of Process, SOP/OCAP, engineering checklists) and ensure process release sign-off.
• Lead technology transfer to production and support HVM ramp to achieve stable Cp/Cpk and manufacturing readiness.
• Drive continuous improvement projects to reduce defect density, cycle time, and improve equipment efficiency.
• Collaborate with technology development, manufacturing/production, equipment engineering, and quality/reliability teams.

Requirements

Must-have technical skills and experience inferred from role duties.

• Experience with semiconductor packaging NPI and process development for HBM or equivalent practical experience in assembly processes.
• Hands-on experience performing DOE, characterization, and parameter optimization.
• Proven ability to analyze production data (FDC, SPC) and perform failure analysis (PFA/EFA) to drive yield improvements.
• Experience defining and validating equipment/tool requirements and supporting tool setup, calibration, and troubleshooting.
• Experience creating and maintaining process documentation (BOP, SOP/OCAP) and managing process release activities.
• Experience with risk assessment methods (FMEA) and implementing process control plans.
• Strong cross-functional communication skills and experience working with manufacturing, equipment engineering, and quality teams.
• Nice-to-have: prior experience in HVM ramp, bonding/stacking/IQP processes, and continuous improvement projects in a semiconductor manufacturing environment.

Education Requirements

Not specified.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.