Packaging Technical Program Manager

Job Title

Packaging Technical Program Manager

Role Summary

Lead cross-functional programs to ensure readiness and execution discipline for advanced packaging, manufacturing quality systems, supplier readiness, and phase-gate deliverables across Assembly, Packaging, Test, and Manufacturing (APTM) operations.

Operate as a technically strong program leader who creates visibility to program health, drives decisions through reviews, and enforces follow-through across Foundry, supplier, and customer-facing teams. This role requires on-site presence in Phoenix, AZ.

Experience Level

Senior — requires 7+ years of relevant experience; preferred candidates have 10+ years.

Responsibilities

Manage programs from planning through close-out to deliver measurable manufacturing and quality outcomes.

• Build and execute project and program plans aligned to phase-gate, technology scope, timelines, resources, and stakeholder expectations.
• Drive program life cycles: planning, implementation, testing, documentation, training, change control, close-out, and lessons learned.
• Lead cross-functional collaboration across APTM, manufacturing, quality, suppliers, automation, central services, and customer-facing teams.
• Create and maintain visibility to schedule, cost, resources, risks, dependencies, quality metrics, KPIs, and readiness status.
• Run schedule, milestone, readiness, and stakeholder reviews to surface issues early and drive decisions.
• Clarify technical, manufacturing, phase-gate, and quality requirements and assign ownership for deliverables.
• Identify risks and execution gaps and define mitigation plans to protect program stability and business continuity.
• Communicate status, impacts, decisions, and recovery actions to technical, operational, and executive audiences.
• Support quality automation, dashboards, Quality Review Board governance, supplier quality initiatives, and systemic quality improvements.

Requirements

Must-have skills and experience for initial consideration; preferred items listed separately.

• 7+ years of experience in packaging technology, manufacturing, quality, engineering, operations, or project/program management environments.
• Track record leading complex, cross-functional projects or programs with measurable business, technical, or operational outcomes.
• Proven ability to build project plans and manage schedules, risks, resources, dependencies, documentation, and stakeholder communications.
• Ability to lead through influence across manufacturing, quality, supplier, central service, customer-facing, and APTM stakeholders.
• Strong stakeholder management, written/verbal communication, problem-solving, and risk-management skills in fast-paced environments.
• Experience running milestone and readiness reviews and driving disciplined follow-through.
• Preferred: 10+ years of relevant experience; experience with APTM, semiconductor manufacturing, substrate or wafer-level assembly, phase-gate execution, supplier quality programs, automation/dashboards/KPIs, and multi-site deployments.

Education Requirements

Bachelor's degree in engineering, technology, operations, program management, or a related discipline is required. A Master’s degree in those fields is preferred. Candidates may meet the minimum qualifications through a combination of industry experience, internships, coursework, or equivalent practical experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.