Packaging Research and Development Engineer

Job Title

Packaging Research and Development Engineer

Role Summary

Join the Substrate Packaging Technology Development (SPTD) team to develop processes and materials that scale advanced substrate packaging for die disaggregation and heterogeneous integration. The role spends most time on the factory floor and works closely with equipment and material suppliers to turn new substrate technologies into manufacturing-ready processes.

Experience Level

Mid-level. Typical experience guidance depends on degree: PhD >=1 year, MS >=3 years, BS >=5 years in relevant work; practical experience in semiconductor process or materials development is expected.

Responsibilities

Primary responsibilities include:

• Define equipment configurations, process specifications, and integrated process flows for new substrate packaging technologies.
• Plan and execute designed experiments (DOEs) to characterize process windows and process/equipment/material interactions.
• Drive continuous improvements in process capability, stability, quality/reliability, cost/yield, automation, and productivity.
• Lead or participate in cross-functional teams to advance substrate technology development and integration.
• Work on the factory floor: operate/own process tools and interact directly with equipment and material suppliers.
• Troubleshoot equipment and process issues; implement corrective actions and SPC monitoring.
• Collect, analyze, and document process data to support development and transfer to manufacturing.

Requirements

Must-have skills and experience:

• Practical experience in semiconductor manufacturing, technology development, or materials development.
• Hands-on factory/equipment experience and the ability to own process tools and troubleshoot equipment.
• Experience planning and executing DOEs and applying statistical process control (SPC).
• Strong written and verbal communication and teamwork skills.
• Willingness to work on-site, spend time on the factory floor, and travel occasionally (<5%).

Nice-to-have / preferred:

• Experience with material characterization techniques (e.g., DSC, TGA, D/TMA, ICP-MS, FTIR, XPS, TOF-SIMS, EDX, SEM).
• Familiarity with statistical data analysis tools and scripting (JMP/JSL, Python), relational databases, and machine learning methods.
• Experience improving yield, cost, automation, and process reliability in technology development projects.

Education Requirements

One of the following is required: Bachelor's degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or a related field with 5+ years of experience; Master's degree in those fields with 3+ years of experience; or PhD in those fields with 1+ year of experience. No specific certifications are listed.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.