Packaging Research and Development Engineer

Job Title

Packaging Research and Development Engineer

Role Summary

Join the Module Engineering Backend team within Substrate Packaging Technology Development to develop and scale advanced substrate packaging technologies for die disaggregation and heterogeneous integration. The role is hands-on on the factory floor, collaborating with suppliers and cross-functional teams to define process flows, qualify equipment and materials, and improve manufacturing performance.

This position is based in Chandler/Phoenix, Arizona and focuses on process engineering, materials characterization, and data-driven process optimization.

Experience Level

Entry-level — 1+ years of relevant science or engineering experience (academic research, internships, or professional experience).

Responsibilities

Core responsibilities include developing processes, executing experiments, and working with suppliers and cross-functional teams to transfer technologies to manufacturing.

• Define equipment configurations, process specifications, and integrated process flows for new packaging technologies.
• Design and execute Design of Experiments (DOEs) to characterize process windows and interactions between equipment, materials, and processes.
• Drive improvements in process capability, stability, yield, cost, automation, and productivity.
• Lead or participate in cross-functional working groups supporting substrate technology development.
• Engage with equipment and materials suppliers to evaluate, qualify, and optimize solutions.
• Apply analytical and characterization techniques to evaluate organic and inorganic materials and processes.
• Analyze complex datasets using statistical tools and programming to produce actionable insights.

Requirements

Summary of required and preferred technical skills and attributes.

Must have:

• 1+ years of relevant experience in a science or engineering field (academic research, internships, or professional experience).
• Hands-on process development experience and comfort working on the factory floor with process tools and materials.
• Ability to design and execute DOEs and apply statistical analysis to process data.
• Programming or scripting skills for data analysis (examples: Python, JMP/JSL).
• Strong written and verbal communication, collaboration, and problem-solving skills.
• Willingness to travel occasionally (less than 5%) to work with suppliers and partners.

Nice to have:

• Experience owning or operating process tools and familiarity with SPC, PCS, and RFC processes.
• Experience with materials characterization techniques (DSC, TGA, D/TMA, ICP-MS, FTIR, XPS, TOF-SIMS, EDX, SEM).
• Familiarity with relational databases and basic machine learning concepts.

Education Requirements

PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a closely related field is required. The posting also specifies 1+ years of relevant experience, which may include academic research, internships, or professional work.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.