Packaging Research and Development Engineer

Job Title

Packaging Research and Development Engineer

Role Summary

Join Intel's Substrate Packaging Technology Development (SPTD) team within the Module Engineering Backend Area to develop processes and materials that scale advanced substrate packaging technology for die disaggregation and heterogeneous integration. The role is factory-floor focused and requires hands-on interaction with process equipment and materials suppliers.

Experience Level

Mid-level. Typical qualification paths in the posting require a Master's degree plus 3+ years' relevant experience, or a PhD plus 1+ year of relevant experience.

Responsibilities

Accountabilities include establishing and maturing process technology and supporting cross-functional integration to enable advanced substrate packaging at production scale.

• Define equipment configurations, process specifications, and integrated process flows for new technologies.
• Plan and execute design-of-experiments (DOE) to characterize process windows and material/equipment interactions.
• Drive continuous improvements in process capability, stability, yield, quality, reliability, automation, and productivity.
• Lead and participate in cross-functional and cross-organizational teams for substrate technology development.
• Work on the factory floor and interact with equipment and materials suppliers to deploy and transfer processes.
• Support root-cause investigations and corrective actions for process and equipment issues.

Requirements

Must-have technical skills and experience for initial consideration; preferred items are listed separately.

• Hands-on experience in semiconductor packaging or substrate manufacturing and factory operations (process tool interaction, equipment troubleshooting, supplier engagement).
• Practical expertise in process characterization and optimization, including DOE and statistical analysis to improve yield and capability.
• Experience with materials characterization and failure analysis applied to packaging (mechanical and materials engineering context).
• Ability to drive cross-team projects and communicate clearly in written and verbal form.
• Willingness to spend most time on the factory floor and to travel occasionally (under 5%).
• Comfort working with ambiguity and flexible hours; able to support shift-based operations.

Nice-to-have:

• Experience owning process tools, SPC/PCS/RFCs, and automation/productivity initiatives.
• Familiarity with organic/inorganic materials and characterization tools (DSC, TGA, D/TMA, ICP-MS, FTIR, XPS, TOF-SIMS, EDX, SEM).
• Experience with statistical software and data analysis (JMP/JSL, Python), relational databases, or machine learning techniques applied to process data.

Education Requirements

Must possess one of: a Masters degree in a relevant science or engineering discipline (e.g., Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry) with 3+ years of related experience; or a PhD in a relevant discipline with 1+ year of related experience. No specific certifications were listed.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.