Packaging Module Equipment Development Engineer

Job Title

Packaging Module Equipment Development Engineer

Role Summary

Join Intel's Packaging Module Development team to develop and optimize assembly packaging processes and equipment that enable next-generation semiconductor packaging and US-based manufacturing. The role focuses on improving manufacturability, equipment reliability, yield, and productivity across development through high-volume manufacturing.

Experience Level

Mid-level — typically 1–3+ years of relevant experience depending on degree (see education requirements for degree-to-experience mapping).

Responsibilities

Primary technical responsibilities and expected contributions:

• Develop, qualify and optimize assembly processes and equipment to meet quality, reliability, cost, yield, and productivity targets.
• Apply Design of Experiments (DOE) and statistical analysis to characterize processes, identify equipment gaps, and define control limits.
• Document technical findings and specifications in clear technical reports.
• Ensure manufacturability of package layouts and oversee equipment lifecycle, health, and long-term reliability from development into high-volume manufacturing.
• Support integration of new materials and architectures into production equipment and processes.
• Develop tools, quality screens, and monitoring to detect and mitigate equipment health and reliability issues.
• Lead root-cause problem solving and continuous improvement projects for processes and equipment.
• Standardize equipment qualification practices and manufacturing quality systems, and manage technical risks against product milestones.

Requirements

Clear must-haves first, followed by preferred skills.

• Must-have: US Citizenship (required for initial consideration).
• Must-have: Proficiency with Statistical Process Control (SPC) and Design of Experiments (DOE).
• On-site work in Phoenix, AZ and ability to work standard manufacturing shift schedules.
• Preferred / Nice-to-have: Experience with high-volume manufacturing, equipment troubleshooting, installation and qualification.
• Understanding of semiconductor fabrication and packaging technologies and materials.
• Experience leading technical innovation, managing complex projects, and driving continuous improvement.
• Experience optimizing procedures or designs for safety, quality, and manufacturability.

Education Requirements

Required degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field: Bachelor's (with ~2+ years relevant experience), Master's (with ~1+ years relevant experience), or PhD. The posting allows relevant combinations of degree, research, and prior job or internship experience to satisfy experience expectations.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.