Packaging Module Equipment Development Engineer

Job Title

Packaging Module Equipment Development Engineer

Role Summary

Develop and qualify assembly processes and equipment for semiconductor packaging platforms to meet reliability, manufacturability, cost, yield and productivity targets. Work with cross-functional teams, suppliers and contract assemblers to integrate equipment and processes into production.

Experience Level

Mid-level. Candidates should have several years of relevant industry experience (typical range for this role is roughly 3–7 years of professional experience).

Responsibilities

Accountabilities include process and equipment development, qualification, and production support to ensure package quality and reliability.

• Develop and optimize assembly processes and equipment; apply experimental design and data analysis to improve yield and manufacturability.
• Define process and equipment specifications and document improvements via technical reports.
• Develop and maintain equipment and test setups to evaluate thermal, humidity, mechanical and reliability performance.
• Ensure manufacturability of package designs and oversee manufacturing process flows and controls.
• Establish material specifications and work with supplier quality and procurement to meet vendor performance and material quality requirements.
• Create and implement quality screens, acceleration methods, and techniques to detect packaging issues early.
• Set reliability requirements, influence design/material selection, and troubleshoot failure mechanisms.
• Lead continuous improvement, problem solving, and standardization of qualification and manufacturing quality systems.
• Provide consultation and timely response to packaging issues and customer requests.

Requirements

Must-have technical skills and experience for immediate contribution. Preferred items listed separately.

• Hands-on experience with semiconductor packaging processes and equipment development or support.
• Experience with process integration, equipment characterization, and manufacturing transfer.
• Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC) and data-driven problem solving.
• Experience with reliability testing and interpreting failure mechanisms (thermal, mechanical, humidity, cycling).
• Ability to develop process and equipment specifications and produce technical documentation.
• Experience collaborating with suppliers and cross-functional teams (quality, procurement, manufacturing).
• Strong project management skills for time-critical technical projects.

Nice-to-have:

• Experience with dispense, molding, and cure equipment technologies.
• Equipment selection, first-time manufacturing integration, sustaining and change-control processes.
• Familiarity with semiconductor fabrication processes and quality data systems.

Education Requirements

Required: Bachelor's degree in Engineering, Physics, Chemistry, or related STEM field with 6+ years industry experience; OR Master's degree in Engineering, Physics, Chemistry, or related STEM field with 3+ years industry experience; OR PhD in Engineering, Physics, Chemistry, or related STEM field with 6+ months industry experience. Qualifications may be met through a combination of relevant job experience, internships, coursework, or research (equivalent practical experience acceptable).

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.