Packaging Module Equipment Development Engineer

Job Title

Packaging Module Equipment Development Engineer

Role Summary

Member of the Assembly Technology Development team within Advanced Packaging Technology Manufacturing. The role develops and scales equipment, materials, and processes for packaging modules (FLI/SLI, TIM1, SMT/PCB) to support Intel packaging platforms and high-volume manufacturing.

This position works cross-functionally to optimize assembly processes for quality, reliability, cost, yield and manufacturability and requires regular onsite presence.

Experience Level

Entry-level / College graduate. The posting targets recent graduates (College Grad) and specifies a PhD with at least 6 months of relevant experience.

Responsibilities

Core responsibilities include equipment and process development, technical support for manufacturing, and project execution.

• Develop and validate first-/second-level interconnect (FLI/SLI), thermal interface materials (TIM1), and SMT/PCB assembly processes and equipment.
• Design and implement equipment, materials, and fabrication process improvements for scale-up to high-volume manufacturing.
• Collaborate with cross-functional teams to optimize processes for quality, reliability, cost, yield and productivity.
• Manage technical projects to meet development timelines and deliverables.
• Provide sustaining support to maintain equipment performance and process health in manufacturing.
• Respond to foundry customer requests and manufacturing events as required.

Requirements

Must-have technical skills and experience, followed by preferred additions.

• Must-have: Relevant experience and deep understanding of solid mechanics including thermal–mechanical coupling and degradation mechanisms (focus on thermal cycling impact).
• Must-have: Ability to manage technical projects and to work independently in a matrixed organization.
• Must-have: Strong written and verbal communication, analytical skills, and ability to operate onsite in Phoenix, AZ.
• Preferred: Experience with technology development practices such as Statistical Process Control (SPC) and Design of Experiments (DOE).
• Preferred: Experience in semiconductor fabrication processes, packaging technology development, or prior foundry-related work.
• Preferred: Demonstrated ability to deliver results on complex, time-critical technical projects.

Education Requirements

PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related STEM field. Posting specifies PhD with at least 6+ months of relevant experience, minimum GPA of 3.5, at least one publication in a peer-reviewed technical journal, and that the required degree must be obtained prior to the start date.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.