Internship - Package Mechanical Simulation

Job Title

Internship - Package Mechanical Simulation

Role Summary

Internship within the Package Core Technology group to implement and validate microstructure-based simulations of solder joint behavior under mechanical and thermal loading. The role focuses on translating theoretical models into production-capable simulation code and evaluating their impact on package reliability.

Work will include algorithm development, integration into NXP's simulation environment, and validation against theoretical and experimental results.

Experience Level

Entry-level internship. Suitable for a current graduate student (Master's). No specific years of professional experience required.

Responsibilities

Primary responsibilities and deliverables for the internship include:

• Develop algorithms to simulate evolution of solder joint microstructures under mechanical and thermal loads.
• Implement theoretical models and scientific formulations into the existing simulation framework.
• Enhance simulation tools that generate realistic microstructures and assign material properties to grains and grain boundaries.
• Investigate degradation mechanisms and analyze their effect on package reliability.
• Validate models against theoretical expectations and available experimental or literature data.
• Develop validation methodologies and benchmark cases for model verification.
• Deliver documentation, a final report, and a presentation summarizing methodology, implementation, validation results, and recommendations.

Requirements

Must-have technical skills and attributes; items listed as "nice-to-have" indicate desirable additional experience.

• Must-have: Strong interest in materials modeling, reliability engineering, computational mechanics, or semiconductor packaging.
• Must-have: Programming and scientific computing experience in Python, MATLAB, C++, or similar languages.
• Must-have: Ability to interpret scientific literature and translate theoretical concepts into computational algorithms.
• Must-have: Strong analytical and problem-solving skills; attention to model validation and accuracy; good written and verbal communication for technical reporting and presentation.
• Nice-to-have: Familiarity with numerical modeling techniques such as finite element methods, computational materials science, or multi-physics simulations.
• Nice-to-have: Basic understanding of material behavior, deformation mechanisms, fracture, fatigue, or microstructural evolution.
• Nice-to-have: Experience with scientific software development, algorithm design, and model validation in research or industrial settings.

Education Requirements

The candidate must be pursuing a Master's degree in Mechanical Engineering, Materials Science, Physics, Computational Engineering, Applied Mathematics, Electrical Engineering, or a related technical discipline.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.