Packaging Module Equipment Development Engineer

Job Title

Packaging Module Equipment Development Engineer

Role Summary

Join Intel's Advanced Packaging Technology Manufacturing (APTM) team within Assembly Technology Development (ATD) to develop and commercialize semiconductor packaging solutions. The role focuses on first- and second-level interconnects (FLI/SLI), thermal interface materials (TIM1), and SMT/PCB technologies, and on scaling equipment and processes for high-volume manufacturing.

This position requires regular onsite presence in Phoenix, AZ and involves cross-functional collaboration, project management, and sustaining support for production equipment and processes.

Experience Level

Entry-level / College graduate role. The posting specifies a PhD with at least 6 months of relevant experience.

Responsibilities

Key responsibilities include:

• Develop FLI/SLI, TIM1, and SMT/PCB process solutions for next-generation packaging platforms.
• Innovate and scale equipment, materials, and fabrication processes for high-volume manufacturing.
• Collaborate across multifunctional teams to optimize quality, reliability, cost, yield, productivity, and manufacturability.
• Manage technical projects and meet product development timelines.
• Provide sustaining support for equipment performance and process health in production.
• Respond promptly to foundry customer requests and production events.
• Apply engineering judgment and formal analysis to solve technical problems.

Requirements

Must-have skills and attributes:

• Minimum ~6 months relevant experience in technology or packaging development (as specified with the degree requirement).
• Deep understanding of solid mechanics and thermal-mechanical coupling, including effects of thermal cycling on degradation.
• Experience with technology development methods; familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE) is a plus.
• Knowledge of semiconductor fabrication processes and foundry operations is preferred.
• Demonstrated technical leadership, strong analytical and communication skills, and ability to work independently in a matrixed organization.
• Ability to manage changing priorities and to coach or mentor technical team members.

Education Requirements

PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related STEM field. Minimum GPA of 3.5. At least one publication in a peer-reviewed technical journal. Degree must be obtained prior to the start date.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.