Packaging Module Engineer

Job Title

Packaging Module Engineer

Role Summary

The Packaging Module Engineer designs, develops, and qualifies packaging solutions and materials to meet product, regulatory, and manufacturing requirements. This role partners with manufacturing, logistics, regulatory, supply chain, and cross-functional teams to ensure safe transport, reliability, and cost-effective packaging for Intel products.

Work is on-site in a manufacturing/foundry context focused on advanced semiconductor packaging processes and scale-up to production.

Experience Level

Entry-level / College graduate. Typical background: Master's in a STEM field plus ~1+ year of educational or work experience, or PhD with ~6+ months of educational or work experience.

Responsibilities

Core responsibilities include development, qualification, and handoff of packaging solutions and ensuring readiness for production and distribution.

• Design, develop, prototype, and qualify packaging materials and solutions to meet product and regulatory requirements.
• Lead packaging development activities: artwork, concepts, prototypes, qualification testing, and specification documentation.
• Collaborate with manufacturing, logistics, regulatory, supply chain, and cross-functional teams to meet operational needs.
• Perform risk analysis and ensure compliance with quality and regulatory standards.
• Identify and implement cost reductions, waste reduction, and process efficiency improvements.
• Evaluate and qualify vendors to support packaging manufacturing startup and scalability.
• Document and maintain technical specifications and packaging test criteria.
• Consult on branding, labeling, SKUs, and bills of material for distribution.

Requirements

Must-have technical skills and experience for initial consideration are listed below; preferred items follow.

• Must-have: Practical experience with product packaging assembly processes and production methodologies.
• Must-have: Knowledge of statistical process control (SPC) and design of experiments (DOE) techniques.
• Must-have: Analytical skills including data analysis and risk assessment; ability to define packaging test criteria and DFM practices.
• Must-have: Experience collaborating with manufacturing, logistics, regulatory, and supply-chain partners.
• Preferred: Experience with surface-mount technologies, solder-joint quality/reliability, and package certification methods.
• Preferred: Familiarity with semiconductor device fabrication and packaging process flows.
• Preferred: Experience leading technical teams, influencing stakeholders, and delivering time-critical technical projects.

Education Requirements

Possess a Master’s degree in Engineering, Physics, Chemistry, or a related STEM field with 1+ years of educational or work experience; OR a PhD in those fields with 6+ months of educational or work experience. (Education plus specified practical experience is required as stated.)

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.