Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Develop and optimize packaging processes, equipment, and materials to advance Intel's substrate and packaging technologies. Work within the Substrate Packaging Technology Development (SPTD) organization to improve manufacturability, reliability, and scalability of advanced packaging solutions.

Collaborate with cross-functional teams, suppliers, and foundry customers to drive process characterization, material specifications, and production readiness.

Experience Level

Mid-level (Experienced hire). Experience expectations depend on academic credential: typical ranges described under Education Requirements (Bachelor's +6 years, Master's +4 years, PhD +2 years).

Responsibilities

Core responsibilities include process and materials development, experimental design, and cross-functional execution:

• Identify early-stage reliability issues and develop technical solutions for packaging technologies.
• Optimize equipment configurations, process specifications, and integration flows for advanced packaging.
• Design and execute experiments to evaluate process-material interactions using DOE and statistical analysis.
• Lead continuous improvement initiatives to improve capability, stability, productivity, automation, yield, and manufacturability.
• Define material specifications and work with supplier quality to ensure compliance, focusing on dielectric materials and processes.
• Manage projects to meet product schedules, milestones, and execution goals.
• Respond professionally and with urgency to customer requests, escalations, and manufacturing events.
• Document technical work in reports and papers and share learnings across the organization.

Requirements

Must-have technical skills and experience to be considered:

• Semiconductor or packaging process development experience.
• Proficiency with design of experiments (DOE), statistical data analysis, and process control tools.
• Experience specifying materials and working with suppliers on quality and compliance.
• Project management and ability to coordinate cross-functional activities to meet schedules.
• Strong analytical, problem-solving, and technical communication skills; ability to document technical findings.

Nice-to-have:

• Experience with patternable dielectric materials formulation and development (e.g., dielectric/photoresist patterning, lamination or coat/bake/develop optimization).
• Hands-on experience developing experimental setups to validate modeling and simulation.
• Experience leading technical teams or mentoring engineers in a matrixed organization.

Education Requirements

Minimum qualifications specify one of the following: Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related field with 6+ years of related experience; OR Master's degree in those fields with 4+ years of related experience; OR PhD in those fields with 2+ years of related experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.