Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

The Packaging Module Development Engineer will develop and scale thermal interface materials, module assembly processes, and related equipment for semiconductor packaging platforms. The role partners with cross-functional teams to optimize quality, reliability, cost, yield, and manufacturability, and provides sustaining support for production equipment and processes.

This position requires regular onsite presence in Phoenix, AZ and involvement in foundry/customer support and project execution.

Experience Level

Entry-level / College graduate. Typical background: recent Master's with ~1+ years relevant experience or a PhD in a related STEM field; candidates may be early-career researchers or recent industry hires.

Responsibilities

Core responsibilities include development, transfer, and sustaining of packaging module technologies and processes.

• Develop thermal interface materials and module-level material/process solutions for future packaging platforms.
• Design, test, and scale fabrication processes, equipment, and tooling for high-volume manufacturing.
• Collaborate with cross-functional teams to optimize yield, reliability, quality, cost, and manufacturability.
• Lead or manage project activities to meet development timelines and deliverables.
• Provide sustaining support for equipment performance and process health in production.
• Respond to foundry and customer technical requests and manufacturing events.

Requirements

Must-have and preferred technical qualifications and skills. See Education Requirements for degree and academic specifics.

• Must-have:
  • Technical problem solving and analytical skills relevant to materials and packaging process development.
  • Ability to manage technical projects and meet development schedules.
  • Experience or demonstrated ability to support equipment and process health in a manufacturing environment.
  • Strong written and verbal communication and the ability to work in a matrixed organization.
  • Regular onsite work in Phoenix, AZ.
• Nice-to-have:
  • Experience with semiconductor fabrication processes or foundry operations.
  • Familiarity with Statistical Process Control (SPC) and Design of Experiments (DOE).
  • Prior experience delivering results on time-critical technical projects in a cross-functional setting.

Education Requirements

Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field with 1+ years of relevant experience, OR a PhD in one of those fields. Minimum GPA of 3.5 and at least one publication in a peer-reviewed technical journal are specified.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.