Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Lead development and qualification of advanced semiconductor packaging assembly processes and equipment to meet reliability, quality, yield, and cost targets in high-volume manufacturing. The role is within Advanced Packaging Technology Manufacturing (APTM) and supports packaging solutions for mobile, edge, and high-performance computing products.

Experience Level

Entry-level / College graduate. Typical experience range: 0–3 years. Posting requires at least 6 months of relevant hands-on experience in process development or characterization.

Responsibilities

Primary technical and delivery responsibilities:

• Develop, optimize, and qualify packaging assembly processes and related equipment to meet quality, reliability, yield, and cost targets.
• Apply Design of Experiments (DOE) and Statistical Process Control (SPC) to improve process efficiency and manufacturability.
• Design and lead experiments and prototype evaluations to assess packaging technologies under representative conditions.
• Collaborate with cross-functional teams to identify and mitigate technical risks in packaging and assembly flows.
• Define material and equipment specifications and work with suppliers to ensure compliance and performance.
• Develop tools, screens, and methods to detect and address packaging reliability issues early.
• Document technical findings, process improvements, qualification results, and produce reports and summaries.
• Drive standardization of qualification procedures, manufacturing systems, and packaging methods for operational consistency.

Requirements

Minimum and preferred technical skills and experience. Education is listed separately under Education Requirements.

• Must have: At least 6 months of hands-on experience in process development and characterization in packaging or manufacturing environments.
• Must have: Proficiency in statistical methods, including Statistical Process Control (SPC) and Design of Experiments (DOE).
• Must have: Experience designing experiments and documenting technical results for process qualification.
• Preferred: Familiarity with semiconductor fabrication processes, packaging flows, and assembly methodologies.
• Preferred: Knowledge of quality systems and documentation standards used in manufacturing and packaging.

Education Requirements

PhD in Engineering, Physics, Chemistry, or a related STEM field is required.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.