Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Develop and optimize package assembly processes and equipment to support Intel's packaging platform technologies. Work with cross-functional teams to ensure manufacturability, quality, reliability and yield for package products.

Regular onsite presence in Phoenix, AZ is required to perform hands-on process development, equipment evaluation, and supplier integration.

Experience Level

Mid-level. Typical experience: approximately 2–4+ years of relevant industry experience depending on degree and background.

Responsibilities

Technical and process responsibilities include:

• Develop and optimize assembly processes and equipment for package technologies to meet quality, reliability, cost, yield and productivity targets.
• Design experiments, analyze data, and document process improvements (white papers, specs).
• Develop and maintain equipment and test setups to evaluate packages under environmental and mechanical stresses (heat, humidity, thermal cycling, dynamic forces).
• Define and enforce material and supplier specifications; coordinate with supplier quality and procurement.
• Establish reliability requirements and influence design, material selection, and process to meet customer needs.
• Create techniques, screening methods and tools for early detection of packaging quality/reliability issues.
• Provide technical consultation on packaging problems and participate in product qualification and manufacturing quality standardization.

Requirements

Concise list of required and preferred skills/conditions. Education requirements are summarized separately below.

Must-have:

• U.S. citizenship and ability to obtain/maintain U.S. government security clearance.
• Minimum 1+ year experience in manufacturing-related inspection (wafer, package, component, part, etc.).
• Experience with process development, equipment specification, and manufacturing troubleshooting.
• Practical knowledge of design of experiments and data analysis.
• Ability to work onsite regularly in Phoenix, AZ.

Nice-to-have / Preferred:

• Experience with statistical process control (SPC) and advanced DOE.
• Background in semiconductor devices and packaging technology, dimensional management for package features and planes.
• Experience with optics and imaging, machine vision, OpenCV, CNN image classification, and computer vision workflows.
• Proficiency with data science and statistics tools (Python preferred), data management and visualization.
• Experience troubleshooting ultra-high precision equipment (optical, laser, motion, electrical systems).

Education Requirements

Bachelor's degree with 4+ years of experience, or Master's degree with 2+ years of experience, in Engineering, Physics, Computer Science, or a related technical field; equivalent practical experience is acceptable per the posting's stated degree-or-experience options.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.