Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Join the Advanced Packaging Mechanical Analysis team to develop multiphysics thermo-mechanical simulations that support design, development, and qualification of advanced semiconductor packages. Work cross-functionally with design, reliability, yield, manufacturing and technology integration teams to identify risks and provide actionable recommendations.

The position requires regular onsite presence in the Phoenix/Chandler, AZ area and involves both simulation and laboratory experimentation.

Experience Level

Mid-level — typically requires 3+ years of relevant thermal-mechanical experience. The role expects an advanced technical background (see Education Requirements).

Responsibilities

Primary responsibilities include simulation development, experimental coordination, and cross-team technical leadership:

• Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.
• Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across various package architectures.
• Design, plan and coordinate laboratory tests and material characterization to quantify material properties and failure mechanisms.
• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide design and process recommendations.
• Drive development programs, plan and communicate activities with internal and external stakeholders.
• Combine experimental and numerical methods and apply statistical or AI/ML analysis to supplement modeling and experiments.

Requirements

Minimum technical and practical qualifications (must-have) and valuable additions (preferred):

• Must-have: 3+ years of thermal-mechanical work or research with emphasis on silicon reliability.
• Must-have: 3+ years of experience using Finite Element Analysis tools for thermo-mechanical problems.
• Must-have: 3+ years of experience with experimental material characterization metrologies such as DMA, TMA, and nano-indentation.
• Must-have: Demonstrated ability to integrate experiments and simulations to solve engineering problems.
• Must-have: Ability to work onsite in the Phoenix/Chandler, AZ area as this role requires regular on-site presence.
• Preferred: Experience with multi-physics simulations (coupled electro-thermal-mechanical, two-phase flows, electroplating, plasma).
• Preferred: Experience with co-packaging optics, optical coupling, fiber pigtail attachment, or free-space optics.
• Preferred: Scripting and automation experience (Python, TCL, MATLAB) to streamline simulation workflows.
• Preferred: Knowledge of advanced packaging technologies and semiconductor packaging processes (die attach, underfill, molding, bumping, surface mount, reflow).
• Preferred: Experience applying AI/ML concepts to simulation or data analysis and previous foundry experience.

Education Requirements

PhD in Mechanical Engineering, Chemical Engineering, Materials Science, or a related field with emphasis in solid mechanics is required.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.