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Packaging Module Development Engineer

Intel Corporation
May 05, 2026
Full-time
On-site
Kulim, Kedah, Malaysia
Process Engineering Jobs, Level - Entry or Early Career

Job Title

Packaging Module Development Engineer

Role Summary

Work on process technology development for surface mount technology (SMT) and board assembly to enable Intel's IC packages and socket products. The role sits within Board Assembly Technology Development (BATD) in the Assembly Technology Development packaging team and supports new product assembly qualification and yield improvement.

Experience Level

Entry-level (College graduate). The posting targets recent college graduates.

Responsibilities

Primary responsibilities focus on developing, validating, and documenting SMT/board assembly processes to meet product requirements and improve yield and reliability.

  • Develop and validate board assembly and SMT process solutions for IC packages and sockets.
  • Design and optimize SMT process parameters: stencil design, solder paste selection, reflow profiling, and inspection criteria.
  • Identify and resolve root causes of defects during SMT process development.
  • Test and evaluate prototype boards using inspection tools such as X-ray and automated optical inspection (AOI).
  • Analyze process data using statistical tools to identify trends and drive continuous improvements.
  • Create detailed process documentation and provide training to manufacturing teams for consistent implementation.

Requirements

Key must-have and desirable skills for candidates.

  • Must-have: Experience or coursework in data analytics and statistical analysis.
  • Must-have: Strong attention to detail, self-starter mindset, discipline, and good communication skills.
  • Nice-to-have: Practical experience with SMT or printed circuit board assembly (PCBA) processes.
  • Nice-to-have: Familiarity with inspection and test equipment used for SMT validation (e.g., X-ray, AOI).

Education Requirements

Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Mechatronics, Applied Physics, or a related engineering field.


About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.

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Date Posted: 2026-05-04