Packaging Module Development Engineer
Work on process technology development for surface mount technology (SMT) and board assembly to enable Intel's IC packages and socket products. The role sits within Board Assembly Technology Development (BATD) in the Assembly Technology Development packaging team and supports new product assembly qualification and yield improvement.
Entry-level (College graduate). The posting targets recent college graduates.
Primary responsibilities focus on developing, validating, and documenting SMT/board assembly processes to meet product requirements and improve yield and reliability.
Key must-have and desirable skills for candidates.
Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Mechatronics, Applied Physics, or a related engineering field.
Company: Intel Corporation
Headquarters: Santa Clara, California, USA
Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.
