Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Work on Assembly Technology Development within Advanced Packaging Technology Manufacturing to develop and scale thermal interface materials, fabrication processes, and module assembly for high-volume semiconductor packaging.

Collaborate across functions and foundry customers to optimize processes for quality, reliability, cost, yield and manufacturability while supporting equipment performance in production.

Experience Level

Entry-level / early career (college graduate). Typical candidate: recent graduate or early-career engineer with up to a few years of relevant experience.

Responsibilities

Key responsibilities include technical development, project execution, and production support.

• Develop thermal interface technologies and material solutions for future packaging platforms.
• Design and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Innovate and scale materials, equipment, and fabrication processes for high-volume manufacturing.
• Manage projects to meet product development timelines and respond to customer requests and events.
• Provide sustaining support for equipment performance and process health in production.
• Collaborate with cross-functional teams and foundry partners to implement technical solutions.
• Apply technical judgment to troubleshoot and solve engineering problems.

Requirements

Must-have technical and interpersonal qualifications (education details are summarized in Education Requirements below).

• Must have: Regular onsite presence and ability to work in a production environment.
• Must have: Strong problem-solving, analytical, and communication skills; ability to work independently and in a matrixed team.
• Must have: Project execution skills and experience delivering results on time-critical technical projects.
• Nice to have: Experience with semiconductor fabrication processes, foundry environments, or high-volume manufacturing.
• Nice to have: Familiarity with Statistical Process Control (SPC), Design of Experiments (DOE), and technology development methodologies.
• Nice to have: Prior experience coaching or leading small technical teams.

Education Requirements

Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, Chemical Engineering, or a related STEM field with 1+ years of relevant experience, OR PhD in the same fields. Minimum GPA of 3.5. At least one publication in a peer-reviewed technical journal.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.