Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Develop and optimize assembly and packaging processes and equipment for advanced semiconductor products. The role supports process definition, qualification, and manufacturability to meet product quality, reliability, cost, yield, and productivity targets.

Experience Level

Entry-level. Typically requires 1+ years of relevant experience; suitable for recent graduates with practical project or internship experience or candidates with a Master's degree.

Responsibilities

Deliver process and equipment solutions that enable next-generation packaging technologies and ensure scalable manufacturing.

• Design and develop assembly processes and production equipment for advanced packaging.
• Optimize manufacturing processes to meet quality, reliability, cost, yield, and productivity targets.
• Create and maintain process and equipment specifications using Design of Experiments (DOE) and data analysis.
• Plan and execute environmental and mechanical tests (heat, humidity, temperature cycling, dynamic forces) to evaluate packaging reliability.
• Evaluate and ensure manufacturability of package designs; manage manufacturing cycles.
• Define material specifications and collaborate with supplier quality and procurement to ensure compliance.
• Develop inspection techniques, tools, and quality screens for packaging assessment.
• Establish reliability standards by analyzing failure mechanisms and influencing design, materials, and processes.
• Provide technical consultation and support for process improvements and customer needs.
• Drive standardization in product qualification and manufacturing quality systems across teams.

Requirements

Minimum and preferred technical skills and experience.

• Must-have: 1+ years of relevant hands-on or project experience in process characterization, equipment adjustment, or manufacturability evaluation.
• Must-have: Familiarity with electronics assembly processes and basic data-driven process analysis.
• Must-have: Practical understanding of reliability concepts and failure mechanisms relevant to packaging.
• Nice-to-have: Proficiency with Statistical Process Control (SPC) and Design of Experiments (DOE) methods.
• Nice-to-have: Hands-on experience in technology manufacturing or semiconductor packaging environments.
• Nice-to-have: Demonstrated ability to collaborate with cross-functional teams on time-sensitive projects.

Education Requirements

Bachelor's or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related technical field. The role expects relevant practical experience (including coursework, projects, internships, or military experience) totaling approximately 1+ years. Equivalent practical experience may be considered where applicable.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.