Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

The Packaging Module Development Engineer develops and scales advanced semiconductor package assembly technologies (FLI/SLI, thermal solutions, SMT/PCB) to support Intel's packaging platforms within the Assembly Technology Development team of Advanced Packaging Technology Manufacturing.

Works cross-functionally to optimize assembly processes for quality, reliability, cost, yield and manufacturability, manages development projects, and provides sustaining support for high-volume manufacturing equipment and processes.

Experience Level

Entry-level. Typical candidates have 1+ years of relevant experience post-graduate (college graduate level).

Responsibilities

Core responsibilities include technical development, project delivery, and cross-functional coordination.

• Develop FLI/SLI interconnects, thermal solutions (TIM1/IHS), and SMT/PCB processes for packaging platforms.
• Innovate materials, equipment, and fabrication processes and scale them for high-volume manufacturing.
• Collaborate with cross-organizational teams to optimize processes for quality, reliability, cost, yield and manufacturability.
• Manage project schedules and deliverables to meet product development timelines.
• Provide sustaining support for equipment performance and process health in production.
• Respond to foundry customer requests and production events.

Requirements

Must-have and preferred qualifications summarized below. Education degree and academic specifics are listed in the Education Requirements section.

• Must-have: Regular onsite presence in Phoenix, AZ; strong communication, analytical, and problem-solving skills; ability to work independently and in a matrixed organization; initiative and adaptability.
• Must-have: Ability to manage projects and meet time-critical technical deliverables.
• Must-have: This position is not eligible for Intel immigration sponsorship.
• Nice-to-have: Experience in technology development, familiarity with Statistical Process Control (SPC) and Design of Experiments (DOE).
• Nice-to-have: Experience with equipment/instrumentation maintenance and semiconductor fabrication or foundry environments.
• Nice-to-have: Prior experience leading or coaching technical teams.

Education Requirements

Master's or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related field. Minimum GPA 3.5 and at least one publication in a peer-reviewed technical journal. Minimum qualifications reference 1+ year of related experience post-degree.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.