Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Develop and optimize substrate processes and equipment to enable Intel's next-generation packaging platform technologies. Work on process definition, equipment configuration, and integrated process flows to meet manufacturability, reliability, cost, yield, and productivity targets.

Collaborate with cross-functional teams to design experiments, characterize process windows, and transfer improved processes to manufacturing.

Experience Level

Entry-level. Minimum 3+ months of relevant experience; experience may include internships, coursework, projects, or military service.

Responsibilities

Key technical and cross-functional responsibilities for substrate process and equipment development:

• Define equipment configurations, establish process specifications, and develop integrated process flows for new substrate technologies.
• Plan and execute designed experiments (DOEs) to characterize process windows and understand interactions among process, equipment, materials, and chemistry.
• Drive continuous improvement of process capability, stability, quality, reliability, cost, and yield.
• Lead and contribute to cross-functional and cross-organizational teams to support substrate technology development.
• Combine experiments and simulations to accelerate development and troubleshooting.
• Document technical findings and communicate results to engineering and manufacturing stakeholders.

Requirements

Must-have technical skills and professional attributes; preferred items are listed separately.

Must-have:

• Hands-on experience with circuit assembly and embedded programming (minimum combined ~3 months).
• Engineering programming skills in Matlab and/or Python; familiarity with CAD modeling.
• Strong analytical and problem-solving skills; ability to work independently and manage ambiguity.
• Effective written and verbal communication and ability to work in cross-functional teams.
• Flexibility to adapt priorities and responsibilities to support business needs.

Nice-to-have / Preferred:

• Experience with commercial mechanical or CFD tools (Comsol, Fluent, Ansys) or similar.
• Semiconductor and/or packaging process experience.
• Programming or scripting applied to AI/ML workflows.
• Demonstrated ability to combine experiments and simulations for problem solving.
• Knowledge of plating chemistry and electrochemistry.

Education Requirements

Required: Bachelor's degree in Biomedical Engineering; Materials Science and Engineering; Chemical Engineering; Mechanical Engineering; or a related STEM degree. OR a Master's degree in the same fields. Relevant experience may be obtained through coursework, projects, internships, or military service. No specific certifications were listed.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.