Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Develop and sustain metrology systems, measurement methods, and inspection equipment to support advanced packaging and Thermal Compression Bonding (TCB) process control, yield, reliability, and manufacturability. Work within the Advanced Packaging Technology and Manufacturing (APTM) organization and collaborate with suppliers, packaging technology development, process engineering, quality, and manufacturing teams.

Experience Level

Mid-level — typically 3–7 years of relevant experience in metrology, instrumentation, or packaging-related engineering roles.

Responsibilities

Lead technical work to enable measurement capability and data-driven process control across lab and manufacturing environments.

• Develop and qualify measurement processes, equipment specifications, calibration methods, and correlation techniques for lab-to-factory use.
• Use design of experiments (DOE), statistical analysis, and measurement system analysis (MSA) to improve repeatability, reproducibility, and consistency across tools, sites, and product generations.
• Establish measurement specifications and ensure measurement traceability and data integrity; collaborate with suppliers and internal teams to meet program needs.
• Provide technical consultation on measurement challenges, equipment issues, tool matching, and lab-to-factory correlation.
• Support standardization of metrology methods and assess readiness to meet product milestones with packaging and process engineering partners.
• Document technical findings and improvements in reports, qualification summaries, and white papers.

Requirements

Must-have technical skills and practical experience. Preferred items follow.

• Must-have: 1+ years hands-on experience in metrology systems development, equipment qualification, calibration, or measurement method development in manufacturing, lab, or engineering environments.
• 2+ years working knowledge of measurement system analysis (MSA): bias, linearity, stability, repeatability, and reproducibility.
• 2+ years experience with electrical measurements and test (continuity, resistance, leakage, signal-integrity basics, or related parametric tests).
• 2+ years experience with optical metrology: microscopes, imaging systems, inspection methods, and/or machine vision.
• 2+ years experience using data analysis tools such as Python, Excel, SQL, or similar for measurement analysis and reporting.
• Ability to apply DOE and statistical methods to identify variation, correlation issues, tool drift, and root causes.

Preferred / nice-to-have:

• Experience in semiconductor manufacturing, especially advanced packaging.
• Experience developing or sustaining metrology systems for process control, product qualification, or reliability evaluation.
• Background in equipment selection, tool qualification, acceptance testing, and calibration traceability.
• Experience with machine vision systems, automated inspection, and camera-based measurement techniques.
• Familiarity with lab-to-factory correlation, tool matching, and cross-tool agreement studies.
• Experience working with suppliers or external calibration/measurement service providers.

Education Requirements

Bachelor's degree with 4+ years, Master's degree with 3+ years, or PhD with 1+ years of relevant experience in Electrical Engineering, Mechanical Engineering, Physics, Metrology, Instrumentation, Optical Engineering, or a related technical discipline (as stated in the posting).

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.