Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Member of Intel's Advanced Packaging Technology Manufacturing (APTM) team in Chandler/ Phoenix, AZ. The role combines metrology engineering, data analytics, and engineering software development to develop inspection recipes, build lightweight desktop applications, and create automated data pipelines that turn equipment outputs into manufacturing insights.

Experience Level

Mid-level. Typical experience expectation: 3–4+ years of relevant industry experience depending on degree (see Education Requirements).

Responsibilities

Primary duties include developing software and metrology solutions that support packaging manufacturing and process control.

• Design, implement, test, deploy, and maintain lightweight desktop applications and automation scripts (Python frameworks such as PyQt/Tkinter or C#/.NET).
• Own the full software development lifecycle: requirements, architecture, coding, testing, version control, documentation, and maintenance.
• Develop, qualify, and optimize advanced packaging inspection recipes, equipment parameters, and processes to meet yield, quality, and throughput targets.
• Build data pipelines to parse raw equipment outputs, perform statistical analysis on multi-dimensional datasets (sensor logs, image stacks, metrology outputs), and write structured results to SQL databases.
• Execute DOE, MSA, and SPC to isolate hardware variation and define process windows.
• Troubleshoot software applications, equipment interfaces, communication protocols, drivers, sensors, and metrology subsystems.
• Collaborate with external equipment suppliers and cross-functional engineering teams to resolve tool faults and improve system reliability.

Requirements

Must-have technical skills and experience; preferred items listed separately.

• Proven software development experience across the full lifecycle (requirements, architecture, coding, testing, deployment, version control, documentation).
• Proficiency in Python or C#/.NET for building desktop applications and engineering automation.
• Experience creating data pipelines and performing statistical analysis; familiarity with SQL for writing structured results.
• Hands-on experience integrating and troubleshooting equipment interfaces, sensors, and metrology/inspection systems.
• Experience applying DOE, MSA, and SPC for process control and hardware characterization.
• Strong problem-solving, cross-functional collaboration, and project management skills.

Nice-to-have:

• Experience with PyQt or Tkinter and scientific Python libraries (NumPy, Pandas) or computer vision and multi-dimensional image datasets.
• Experience in advanced packaging flows, metrology systems, or high-volume semiconductor manufacturing.
• Experience managing equipment setups, calibrations, recipe optimization, and performance evaluations.

Education Requirements

One of the following is required: a Bachelor’s degree in Engineering, Computer Science, Physics, Materials Science, or a related STEM field with 4+ years relevant industry experience; OR a Master’s degree in a matching STEM discipline with 3+ years relevant industry experience; OR a PhD in a matching STEM discipline with no prior professional experience. Relevant experience includes software development lifecycle work, Python or C#/.NET development, data science/statistical analysis/SQL, equipment integration and troubleshooting, or semiconductor packaging/metrology process work.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.