Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Develop and optimize substrate processes and equipment for advanced packaging substrate technologies focused on multi-metal plating modules and surface preparation. Work within a team developing first-of-a-kind embedded die packaging manufacturing capability to improve manufacturability, reliability, yield, cost, and productivity.

Experience Level

Entry-level / Early career — requires approximately 2+ years of relevant industry or research experience.

Responsibilities

Deliver process development and equipment qualification for new substrate technologies and support manufacturing readiness.

• Design, install, qualify, and configure process equipment and integrated process flows.
• Develop multi-metal plating modules, focusing on surface preparation, electroless and electrolytic plating.
• Plan and run DOEs to characterize process windows and interactions between process, equipment, materials, and chemistry.
• Drive continuous improvements for capability, stability, quality, reliability, cost, yield, automation, and productivity.
• Lead or participate in cross-functional teams to advance substrate technology development.
• Work effectively in a fast-paced, changing environment with ambiguous requirements.

Requirements

Must-have technical experience and skills; preferred items listed separately.

• Minimum ~2+ years of relevant experience in packaging module development or similar semiconductor manufacturing roles.
• Experience with process equipment design, installation, qualification, and establishing equipment configurations and process specifications.
• Hands-on experience defining integrated process flows for new process technologies.
• Practical experience planning and executing DOEs and interpreting results.
• Demonstrated technical leadership, strong written and verbal communication, and ability to work independently in a matrixed organization.
• Preferred: knowledge of plating chemistry and electrochemistry; experience driving continuous process improvements.

Education Requirements

Required: Bachelor's degree in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Engineering, Mechanical Engineering, Construction Management, or a related engineering discipline (the posting requires a Bachelor's plus ~2+ years experience). Master's degree in the fields above is listed as an additional qualification; PhD is noted as preferred. The posting allows related engineering degrees; equivalent practical experience is implied by experience-based requirements.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.