Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Join the Assembly Technology Development team to develop and commercialize first-level interconnect (FLI) and related packaging technologies for Intel's advanced packaging platforms. The role focuses on equipment, materials, and process development and scaling to high-volume manufacturing.

Work cross-functionally to optimize assembly processes for quality, reliability, yield, cost, productivity and manufacturability while supporting sustaining engineering and responding to manufacturing events.

Experience Level

Mid-level. Typically requires 3+ years of relevant industry or research experience; candidates with equivalent experience will be considered.

Responsibilities

Primary responsibilities include technology development, equipment definition, and process scale-up for semiconductor packaging.

• Develop First Level Interconnect (FLI) technologies to support future packaging platforms.
• Collaborate with cross-functional teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in equipment, materials, and fabrication processes and lead equipment development activities (pathfinding, specification, selection, development, and transition to volume manufacturing).
• Manage projects to meet product development schedules and execution milestones.
• Apply engineering principles and professional judgment to solve complex technical problems.
• Provide sustaining engineering support to maintain equipment performance and process health in high-volume manufacturing.
• Respond to foundry customer requests, escalations, and manufacturing events with urgency.

Requirements

Minimum technical and professional requirements and preferred qualifications.

• Must-have: Programming/script development experience (e.g., Python, MATLAB) with familiarity of artificial intelligence and machine learning concepts.
• Must-have: Demonstrated ability to manage projects and work effectively in cross-functional, matrixed teams.
• Must-have: Strong communication, influencing, analytical, and problem-solving skills; initiative and ability to work independently.
• Must-have: Regular onsite presence is required.
• Nice-to-have: Experience in technology development using Statistical Process Control (SPC) and/or Design of Experiments (DOE).
• Nice-to-have: Experience with semiconductor fabrication processes and prior foundry or high-volume manufacturing experience.
• Nice-to-have: Proven delivery of results on complex, time-critical technical projects and experience leading technical teams.

Education Requirements

Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field plus 3+ years of relevant experience, OR a PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field. Relevant experience may include schoolwork, projects, internships, or military experience.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.